Publications

Found 2 results
Filters: Author is Veteran, J. L.  [Clear All Filters]
2002
C. L. Gan, Thompson, C. V., Pey, K. L., Choi, W. K., Wei, F., Yu, B., and Hau-Riege, S. P., “Experimental characterization of the reliability of 3-terminal dual-damascene copper interconnect trees”, in Silicon Materials-Processing, Characterization and Reliability, vol. 716, J. L. Veteran, OMeara, D. L., Misra, V., and Ho, P. S. 2002, pp. 431 - 436.
F. Wei, Gan, C. L., Thompson, C. V., Clement, J. J., Hau-Riege, S. P., Pey, K. L., Choi, W. K., Tay, H. L., Yu, B., and Radhakrishnan, M. K., “Length effects on the reliability of dual-damascene Cu interconnects”, in Silicon Materials-Processing, Characterization and Reliability, vol. 716, J. L. Veteran, OMeara, D. L., Misra, V., and Ho, P. S. 2002, pp. 645 - 650.