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Z. - S. Choi, Monig, R., Thompson, C. V., and Burns, M., Kinetics of void drift in copper interconnects, in Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects, vol. 914, T. Y. Tsui, Joo, Y. C., Michaelson, L., Lane, M., and Volinsky, A. A. 2006, pp. 363 - 368.