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K. Wada, Chen, T., Michel, J., Kimerling, L. C., Aga, H., Mitani, K., Abe, T., and Suezawa, M., Photonic bandgap formation by wafer bonding and delamination, in Iii-V and Iv-Iv Materials and Processing Challenges for Highly Integrated Microelectronics and Optoelectronics, vol. 535, S. A. Ringel, Fitzgerald, E. A., Adesida, I., and Houghton, D. C. 1999, pp. 121 - 126.