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C. L. Gan, Thompson, C. V., Pey, K. L., Choi, W. K., Chang, C. W., and Guo, Q., Experimental characterization of the reliability of multi-terminal dual-damascene copper interconnect trees, in Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2003, vol. 766, A. J. McKerrow, Leu, J., Kraft, O., and Kikkawa, T. 2003, pp. 121 - 126.