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Filters: Author is Iwai, H.  [Clear All Filters]
L. Yang, Cheng, C. W., Bulsara, M. T., and Fitzgerald, E. A., Effect of Al2O3/InGaAs Interface on Channel Mobility, Ulsi Process Integration 7, vol. 41, no. 7, pp. 219 - 225, 2011.
L. C. Kimerling and Michel, J., Monolithic Microphotonic Integration on the Silicon Platform, Ulsi Process Integration 7, vol. 41, no. 7, pp. 3 - 13, 2011.
N. Y. Pacella, Bulsara, M. T., and Fitzgerald, E. A., Si CMOS Contacts to III-V Materials for Monolithic Integration of III-V and Si Devices, in Silicon Compatible Materials, Processes, and Technologies for Advanced Integrated Circuits and Emerging Applications, vol. 35, F. Roozeboom, Kwong, D. L., Timans, P. J., Gusev, E. P., Iwai, H., Ozturk, M. C., and Narayanan, V. 2011, pp. 225 - 229.
J. Liu, Beals, M., Michel, J., and Kimerling, L. C., Light up the Future of Silicon Microprocessors, in Advanced Gate Stack, Source/Drain, and Channel Engineering for Si-Based Cmos 5: New Materials, Processes, and Equipment, vol. 19, V. Narayanan, Roozeboom, F., Kwong, D. L., Iwai, H., Gusev, E. P., and Timans, P. J. 2009, pp. 17 - 28.
E. A. Fitzgerald, Bulsara, M. T., Bai, Y., Cheng, C., Liu, W. K., Lubyshev, D., Fastenau, J. M., Wu, Y., Urtega, M., Ha, W., Bergman, J., Brar, B., Drazek, C., Daval, N., Letertre, F. D., Hoke, W. E., LaRoche, J. R., Herrick, K. J., and Kazior, T. E., Monolithic III-V/Si Integration, in Graphene and Emerging Materials for Post-Cmos Applications, vol. 19, Y. Obeng, DeGendt, S., Srinivasan, P., Misra, D., Iwai, H., Karim, Z., Hess, D. W., and Grebel, H. 2009, pp. 345 - 350.