Carl V. Thompson

  • Stavros Salapatas Professor of Materials Science and Engineering
  • Director, Materials Research Laboratory (MRL) at MIT
  • SB, Materials Science and Engineering, MIT, 1976
  • SM, Applied Physics, Harvard University, 1977
  • PhD, Applied Physics, Harvard University, 1982

Electrochemistry; Electronic Materials; Energy Storage; Mechanical Behavior of Materials; MEMS (Micro-Electro-Mechanical Systems); Nanotechnology; Surfaces, Interfaces, and Thin Films

Carl V. Thompson

Research

Professor Thompson and his students carry out research on thin films and nanostructures for use in micro- and nano-systems, especially electronic, electromechanical and electrochemical systems.  His group carries out basic research on structure evolution during deposition and post-deposition processing of thin films. The latter includes research on templated solid-state dewetting of thin films and nanostructures, for development of new patterning methods and for basic studies of capillary-driven morphological evolution.  Prof. Thompson's group also carries out research on the mechanisms of carbon nanotube growth and metal-catalyzed etching for creation of semiconductor nanowire arrays.  Carbon nanotubes are also used in research on metal-air batteries and capacitive desalination devices, and  nanowires are used in research on solid state supercapacitors.  Thin film Li-ion microbatteries and thermogalvanic energy harvesting devices for applications in autonomous microsystems are also under investigation.

Recent News

Carl Thompson is profiled on MIT News

Carl Thompson, the Stavros Salapatas Professor of Materials Science and Engineering, is the co-director of the newly organized Materials Research Laboratory at MIT. MRL is the combination of MIT's long-established Materials Processing Center with the Center for Materials Science and Engineering…   more

Materials Day Recap

Our friends at the Materials Processing Center recently held their annual Materials Day event. As part of the day of events, several DMSE faculty participated in a series of talks about battery challenges. The day also included a Poster Session contest. The winners of the contest were Ping-Chun…   more

The MPC and CMSE have new summer interns

"MIT is very fortunate to have this very talented group of students with us, and the faculty all hope that one of them will work with their group," says Carl V. Thompson, director of the Materials Processing Center and Stavros Salapatas Professor of Materials Science and Engineering at MIT.…   more

Fostering U.S.-Russia energy innovation

Skoltech Center for Electrochemical Energy Storage brings together researchers from MIT and two Russian institutes to develop advanced batteries and fuel cells.   more

Using Nanotubes in Computer Chips

Researchers in the lab of MIT materials science professor Carl V. Thompson grew dense forests of crystalline carbon nanotubes on a metal surface at temperatures close to those characteristic of computer chip manufacturing. Unlike previous attempts to do the same thing, the researchers' technique…   more

Publications

2018

P. A. Linford, Xu, L., Huang, B., Shao-Horn, Y., and Thompson, C. V., “Multi-cell thermogalvanic systems for harvesting energy from cyclic temperature changes”, Journal of Power Sources, vol. 399. pp. 429-435, 2018.
D. Perego, Heng, J. S. T., Wang, X., Shao-Horn, Y., and Thompson, C. V., “High-performance polycrystalline RuOx cathodes for thin film Li-ion batteries”, Electrochimica Acta, vol. 283. pp. 228-233, 2018.
H. K. Mutha, Cho, J., Hashempour, M., Wardle, B. L., Thompson, C. V., and Wang, E. N., “Salt rejection in flow-between capacitive deionization devices”, Desalination, vol. 437. pp. 154-163, 2018.
J. Miao and Thompson, C. V., “Kinetic Study of the Initial Lithiation of Amorphous Silicon Thin Film Anodes”, Journal of The Electrochemical Society, vol. 165. p. A650—A656, 2018.

2017

R. Tatara et al., “Oxygen Reduction Reaction in Highly Concentrated Electrolyte Solutions of Lithium Bis(trifluoromethanesulfonyl)amide/Dimethyl Sulfoxide”, The Journal of Physical Chemistry C, vol. 121. pp. 9162-9172, 2017.
W. Zheng, Cheng, Q., Wang, D., and Thompson, C. V., “High-performance solid-state on-chip supercapacitors based on Si nanowires coated with ruthenium oxide via atomic layer deposition”, Journal of Power Sources, vol. 341. pp. 1-10, 2017.
R. Tatara et al., “Oxygen Reduction Reaction in Highly Concentrated Electrolyte Solutions of Lithium Bis(trifluoromethanesulfonyl)amide/Dimethyl Sulfoxide”, Journal of Physical Chemistry C, vol. 121. pp. 9162-9172, 2017.
H. K. Mutha et al., “Porosimetry and packing morphology of vertically aligned carbon nanotube arrays via impedance spectroscopy”, Nanotechnology, vol. 28. p. 05LT01, 2017.
R. I. Made et al., “Characterization of Defects Generated During Constant Current InGaN-on-Silicon LED Operation”, Microelectronics Reliability. 2017.

2016

A. Al-Obeidi, Kramer, D., Boles, S. T., önig, R., and Thompson, C. V., “Mechanical measurements on lithium phosphorous oxynitride coated silicon thin film electrodes for lithium-ion batteries during lithiation and delithiation”, Applied Physics Letters, vol. 109. p. 071902, 2016.
G. J. Syaranamual et al., “Role of two-dimensional electron gas (2DEG) in AlGaN/GaN high electron mobility transistor (HEMT) ON-state degradation”, Microelectronics Reliability, vol. 64. pp. 589-593, 2016.
W. A. Sasangka, Syaranamual, G. J., Made, R. I., Thompson, C. V., and Gan, C. L., “Threading dislocation movement in AlGaN/GaN-on-Si high electron mobility transistors under high temperature reverse bias stressing”, AIP Advances, vol. 6257. p. 095102, 2016.
A. Al-Obeidi, Kramer, D., önig, R., and Thompson, C. V., “Mechanical stresses and crystallization of lithium phosphorous oxynitride-coated germanium electrodes during lithiation and delithiation”, Journal of Power Sources, vol. 306. pp. 817-825, 2016.
S. Y. Sayed et al., “Revealing instability and irreversibility in nonaqueous sodium\textendashO 2 battery chemistry”, Chem. Commun., vol. 523911621114461163119751512661681761584167155119119. pp. 9691-9694, 2016.
D. G. Kwabi, Batcho, T. P., Feng, S., Giordano, L., Thompson, C. V., and Shao-Horn, Y., “The effect of water on discharge product growth and chemistry in Li-O-2 batteries”, Physical Chemistry Chemical Physics, vol. 18. pp. 24944-24953, 2016.
S. C. Tan, Zhao, H., and Thompson, C. V., “Fabrication of high aspect ratio AFM probes with different materials inspired by TEM "lift-out" method”, Journal of Vacuum Science & Technology B, vol. 34. p. 051805, 2016.
G. H. Kim, Ma, W., Yildiz, B., and Thompson, C. V., “Effect of annealing ambient on anisotropic retraction of film edges during solid-state dewetting of thin single crystal films”, Journal of Applied Physics, vol. 120. p. 075306, 2016.
R. V. Zucker, Carter, C., and Thompson, C. V., “Power-law scaling regimes for solid-state dewetting of thin films”, Scripta Materialia, vol. 116. pp. 143-146, 2016.
R. V. Zucker, Kim, G. H., Ye, J., Carter, C., and Thompson, C. V., “The mechanism of corner instabilities in single-crystal thin films during dewetting”, Journal of Applied Physics, vol. 119. p. 125306, 2016.
D. G. Kwabi, Bryantsev, V. S., Batcho, T. P., Itkis, D. M., Thompson, C. V., and Shao-Horn, Y., “Experimental and Computational Analysis of the Solvent-Dependent O-2/Li+-O-2(-) Redox Couple: Standard Potentials, Coupling Strength, and Implications for Lithium-Oxygen Batteries”, Angewandte Chemie-International Edition, vol. 55. pp. 3129-3134, 2016.
C. Y. Khoo et al., “Impact of deposition conditions on the crystallization kinetics of amorphous GeTe films”, Journal of Materials Science, vol. 51. pp. 1864-1872, 2016.
D. G. Kwabi, lodziecki, \l \, Pour, N., Itkis, D. M., Thompson, C. V., and Shao-Horn, Y., “Controlling Solution-Mediated Reaction Mechanisms of Oxygen Reduction Using Potential and Solvent for Aprotic Lithium--Oxygen Batteries”, The Journal of Physical Chemistry Letters, vol. 7. pp. 1204-1212, 2016.

2015

S. A. Jang, Lee, H. J., Thompson, C. V., Ross, C. A., and Oh, Y. J., “Crystallographic analysis of the solid-state dewetting of polycrystalline gold film using automated indexing in a transmission electron microscope”, Apl Materials, vol. 3. p. 126103, 2015.
A. Al-Obeidi, Kramer, D., Thompson, C. V., and Moenig, R., “Mechanical stresses and morphology evolution in germanium thin film electrodes during lithiation and delithiation”, Journal of Power Sources, vol. 297. pp. 472-480, 2015.
N. Ortiz-Vitoriano et al., “Rate-Dependent Nucleation and Growth of NaO2 in Na-O-2 Batteries”, Journal of Physical Chemistry Letters, vol. 6. pp. 2636-2643, 2015.
R. S. Omampuliyur et al., “Nanostructured Thin Film Silicon Anodes for Li-Ion Microbatteries”, Journal of Nanoscience and Nanotechnology, vol. 15. pp. 4926-4933, 2015.
H. Z. Yu and Thompson, C. V., “Stress engineering using low oxygen background pressures during Volmer-Weber growth of polycrystalline nickel films”, Journal of Vacuum Science & Technology A, vol. 33. p. 021504, 2015.
G. H. Kim and Thompson, C. V., “Effect of surface energy anisotropy on Rayleigh-like solid-state dewetting and nanowire stability”, Acta Materialia, vol. 84. pp. 190-201, 2015.
C. Q. Lai, Zheng, W., Choi, W. K., and Thompson, C. V., “Metal assisted anodic etching of silicon”, Nanoscale, vol. 7. pp. 11123-11134, 2015.
W. A. Sasangka, Gan, C. L., Lai, D., Tan, C. S., and Thompson, C. V., “Characterization of the Young's modulus, residual stress and fracture strength of Cu-Sn-In thin films using combinatorial deposition and micro-cantilevers”, Journal of Micromechanics and Microengineering, vol. 25. p. 035023, 2015.

2014

H. Z. Yu and Thompson, C. V., “Response to "Comment on \textquoterightCorrelation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth\textquoteright" [Appl. Phys. Lett. 105, 246101 (2014)]”, Applied Physics Letters, vol. 105. 2014.
H. Z. Yu and Thompson, C. V., “Effects of oblique-angle deposition on intrinsic stress evolution during polycrystalline film growth”, Acta Materialia, vol. 77. pp. 284-293, 2014.
D. G. Kwabi et al., “Chemical Instability of Dimethyl Sulfoxide in Lithium-Air Batteries”, Journal of Physical Chemistry Letters, vol. 5. pp. 2850-2856, 2014.
H. Z. Yu and Thompson, C. V., “Correlation of shape changes of grain surfaces and reversible stress evolution during interruptions of polycrystalline film growth”, Applied Physics Letters, vol. 104. 2014.
H. Z. Yu and Thompson, C. V., “Grain growth and complex stress evolution during Volmer-Weber growth of polycrystalline thin films”, Acta Materialia, vol. 67. pp. 189-198, 2014.
F. Gao, Chen, D., Tuller, H. L., Thompson, C. V., and Palacios, T., “On the redox origin of surface trapping in AlGaN/GaN high electron mobility transistors”, Journal of Applied Physics, vol. 115. 2014.
S. T. Boles, Thompson, C. V., Kraft, O., and Moenig, R., “In situ tensile and creep testing of lithiated silicon nanowires (vol 103, 263906, 2013)”, Applied Physics Letters, vol. 104. 2014.
F. Gao, Tan, S. C., del Alamo, J. A., Thompson, C. V., and Palacios, T., “Impact of Water-Assisted Electrochemical Reactions on the OFF-State Degradation of AlGaN/GaN HEMTs”, Ieee Transactions on Electron Devices, vol. 61. pp. 437-444, 2014.
H. Z. Yu, Leib, J. S., Boles, S. T., and Thompson, C. V., “Fast and slow stress evolution mechanisms during interruptions of Volmer-Weber growth”, Journal of Applied Physics, vol. 115. 2014.

2013

S. T. Boles, Thompson, C. V., Kraft, O., and Moenig, R., “In situ tensile and creep testing of lithiated silicon nanowires”, Applied Physics Letters, vol. 103. 2013.
C. Q. Lai, Cheng, H., Choi, W. K., and Thompson, C. V., “Mechanics of Catalyst Motion during Metal Assisted Chemical Etching of Silicon”, Journal of Physical Chemistry C, vol. 117. pp. 20802-20809, 2013.
B. M. Gallant, Kwabi, D. G., Mitchell, R. R., Zhou, J., Thompson, C. V., and Shao-Horn, Y., “Influence of Li2O2 morphology on oxygen reduction and evolution kinetics in Li-O-2 batteries”, Energy & Environmental Science, vol. 6. pp. 2518-2528, 2013.
J. C. Moore and Thompson, C. V., “A Phenomenological Model for the Photocurrent Transient Relaxation Observed in ZnO-Based Photodetector Devices”, Sensors, vol. 13. pp. 9921-9940, 2013.
Z. Wang et al., “Synthesis and magnetic properties of large-area ferromagnetic cylindrical nanoshell and nanocup arrays”, Journal of Applied Physics, vol. 113. 2013.
L. Zhong et al., “In Situ Transmission Electron Microscopy Observations of Electrochemical Oxidation of Li2O2”, Nano Letters, vol. 13. pp. 2209-2214, 2013.
R. R. Mitchell, Gallant, B. M., Shao-Horn, Y., and Thompson, C. V., “Mechanisms of Morphological Evolution of Li2O2 Particles during Electrochemical Growth”, Journal of Physical Chemistry Letters, vol. 4. pp. 1060-1064, 2013.
G. H. Kim, Zucker, R. V., Ye, J., Carter, C., and Thompson, C. V., “Quantitative analysis of anisotropic edge retraction by solid-state dewetting of thin single crystal films”, Journal of Applied Physics, vol. 113. 2013.
R. R. Mitchell, Yamamoto, N., Cebeci, H., Wardle, B. L., and Thompson, C. V., “A technique for spatially-resolved contact resistance-free electrical conductivity measurements of aligned-carbon nanotube/polymer nanocomposites”, Composites Science and Technology, vol. 74. pp. 205-210, 2013.
Y. -J. Oh, Kim, J. -H., Thompson, C. V., and Ross, C. A., “Templated assembly of Co-Pt nanoparticles via thermal and laser-induced dewetting of bilayer metal films”, Nanoscale, vol. 5. pp. 401-407, 2013.

2012

R. Enright, Miljkovic, N., Al-Obeidi, A., Thompson, C. V., and Wang, E. N., “Condensation on Superhydrophobic Surfaces: The Role of Local Energy Barriers and Structure Length Scale”, Langmuir, vol. 28. pp. 14424-14432, 2012.
B. M. Gallant et al., “Chemical and Morphological Changes of Li-O-2 Battery Electrodes upon Cycling”, Journal of Physical Chemistry C, vol. 116. pp. 20800-20805, 2012.
F. Gao et al., “Impact of Moisture and Fluorocarbon Passivation on the Current Collapse of AlGaN/GaN HEMTs”, Ieee Electron Device Letters, vol. 33. pp. 1378-1380, 2012.
W. Jiang, Bao, W., Thompson, C. V., and Srolovitz, D. J., “Phase field approach for simulating solid-state dewetting problems”, Acta Materialia, vol. 60. pp. 5578-5592, 2012.
G. D. Nessim et al., “Synthesis of tall carpets of vertically aligned carbon nanotubes by in situ generation of water vapor through preheating of added oxygen”, Carbon, vol. 50. pp. 4002-4009, 2012.
C. Q. Lai, Thompson, C. V., and Choi, W. K., “Uni-, Bi-, and Tri-Directional Wetting Caused by Nanostructures with Anisotropic Surface Energies”, Langmuir, vol. 28. pp. 11048-11055, 2012.
A. L. Giermann and Thompson, C. V., “Three-dimensional graphoepitaxial alignment resulting from solid-state dewetting of Au films on surfaces with monoperiodic topography”, Applied Physics Letters, vol. 101. 2012.
L. Li, Joh, J., del Alamo, J. A., and Thompson, C. V., “Spatial distribution of structural degradation under high-power stress in AlGaN/GaN high electron mobility transistors”, Applied Physics Letters, vol. 100. 2012.
R. I. Made et al., “Experimental characterization and modeling of the mechanical properties of Cu-Cu thermocompression bonds for three-dimensional integrated circuits”, Acta Materialia, vol. 60. pp. 578-587, 2012.
C. V. Thompson, “Solid-State Dewetting of Thin Films”, Annual Review of Materials Research, Vol 42, vol. 42. pp. 399-434, 2012.
P. Lianto, Yu, S., Wu, J., Thompson, C. V., and Choi, W. K., “Vertical etching with isolated catalysts in metal-assisted chemical etching of silicon”, Nanoscale, vol. 4. pp. 7532-7539, 2012.

2011

F. Gao et al., “Role of oxygen in the OFF-state degradation of AlGaN/GaN high electron mobility transistors”, Applied Physics Letters, vol. 99. 2011.
W. A. Sasangka, Gan, C. L., Thompson, C. V., Choi, W. K., and Wei, J., “Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films”, Journal of Electronic Materials, vol. 40. pp. 2329-2336, 2011.
C. Liu et al., “Conductance Preservation of Carbene-Functionalized Metallic Single-Walled Carbon Nanotubes (vol 7, pg 1257, 2011)”, Acs Nano, vol. 5. pp. 7684-7684, 2011.
Z. -S. Choi, Lee, J., Lim, M. K., Gan, C. L., and Thompson, C. V., “Void dynamics in copper-based interconnects”, Journal of Applied Physics, vol. 110. 2011.
R. R. Mitchell, Gallant, B. M., Thompson, C. V., and Shao-Horn, Y., “All-carbon-nanofiber electrodes for high-energy rechargeable Li-O-2 batteries”, Energy & Environmental Science, vol. 4. pp. 2952-2958, 2011.
A. L. Giermann and Thompson, C. V., “Requirements for graphoepitaxial alignment through solid-state dewetting of Au films”, Journal of Applied Physics, vol. 109. 2011.
J. Oh and Thompson, C. V., “The role of electric field in pore formation during aluminum anodization”, Electrochimica Acta, vol. 56. pp. 4044-4051, 2011.
J. Ye and Thompson, C. V., “Templated Solid-State Dewetting to Controllably Produce Complex Patterns”, Advanced Materials, vol. 23. pp. 1567-1571, 2011.
G. D. Nessim et al., “Precursor gas chemistry determines the crystallinity of carbon nanotubes synthesized at low temperature”, Carbon, vol. 49. pp. 804-810, 2011.
J. Ye and Thompson, C. V., “Anisotropic edge retraction and hole growth during solid-state dewetting of single crystal nickel thin films”, Acta Materialia, vol. 59. pp. 582-589, 2011.
Q. Guo, Zhang, L., Zeiger, A. S., Li, Y., Van Vliet, K. J., and Thompson, C. V., “Compositional dependence of Young's moduli for amorphous Cu-Zr films measured using combinatorial deposition on microscale cantilever arrays”, Scripta Materialia, vol. 64. pp. 41-44, 2011.
H. Mario et al., “Effects of Side Reservoirs on the Electromigration Lifetime of Copper Interconnects”, 2011 18th Ieee International Symposium on the Physical and Failure Analysis of Integrated Circuits (ipfa). 2011.
W. A. Sasangka, Gan, C. L., and Thompson, C. V., “Mechanical Property Characterization of Cu-Sn-In Intermetallic Thin Films using Microcantilevers”, 2011 18th Ieee International Symposium on the Physical and Failure Analysis of Integrated Circuits (ipfa). 2011.
J. Oh, Shin, Y. C., and Thompson, C. V., “A Tungsten Interlayer Process for Fabrication of Through-Pore AAO Scaffolds on Gold Substrates”, Journal of the Electrochemical Society, vol. 158. pp. K11 - K15, 2011.
J. Oh and Thompson, C. V., “Abnormal Anodic Aluminum Oxide Formation in Confined Structures for Lateral Pore Arrays”, Journal of the Electrochemical Society, vol. 158. pp. C71 - C75, 2011.

2010

S. -W. Chang, Chuang, V. P., Boles, S. T., and Thompson, C. V., “Metal-Catalyzed Etching of Vertically Aligned Polysilicon and Amorphous Silicon Nanowire Arrays by Etching Direction Confinement”, Advanced Functional Materials, vol. 20. pp. 4364-4370, 2010.
H. Q. Le et al., “Growth of single crystal ZnO nanorods on GaN using an aqueous solution method (Retraction of vol 87, 101908, 2005)”, Applied Physics Letters, vol. 97. 2010.
J. Ye and Thompson, C. V., “Regular pattern formation through the retraction and pinch-off of edges during solid-state dewetting of patterned single crystal films”, Physical Review B, vol. 82. 2010.
H. Zhang, Thompson, C. V., Stellacci, F., and Thong, J. T. L., “Parallel fabrication of polymer-protected nanogaps”, Nanotechnology, vol. 21. 2010.
J. Leib and Thompson, C. V., “Weak temperature dependence of stress relaxation in as-deposited polycrystalline gold films”, Physical Review B, vol. 82. 2010.
J. Ye and Thompson, C. V., “Mechanisms of complex morphological evolution during solid-state dewetting of single-crystal nickel thin films”, Applied Physics Letters, vol. 97. 2010.
D. Kim, Makaram, P., and Thompson, C. V., “Microscale oscillating crack propagation in silicon nitride thin films”, Applied Physics Letters, vol. 97. 2010.
P. Makaram, Joh, J., del Alamo, J. A., Palacios, T., and Thompson, C. V., “Evolution of structural defects associated with electrical degradation in AlGaN/GaN high electron mobility transistors”, Applied Physics Letters, vol. 96. 2010.
Q. Guo, Noh, J. H., Liaw, P. K., Rack, P. D., Li, Y., and Thompson, C. V., “Density change upon crystallization of amorphous Zr-Cu-Al thin films”, Acta Materialia, vol. 58. pp. 3633-3641, 2010.
G. D. Nessim, Acquaviva, D., Seita, M., O\textquoterightBrien, K. P., and Thompson, C. V., “The Critical Role of the Underlayer Material and Thickness in Growing Vertically Aligned Carbon Nanotubes and Nanofibers on Metallic Substrates by Chemical Vapor Deposition”, Advanced Functional Materials, vol. 20. pp. 1306-1312, 2010.
S. -W. Chang, Oh, J., Boles, S. T., and Thompson, C. V., “Fabrication of silicon nanopillar-based nanocapacitor arrays”, Applied Physics Letters, vol. 96. 2010.
J. Yun et al., “Field emission from a large area of vertically-aligned carbon nanofibers with nanoscale tips and controlled spatial geometry”, Carbon, vol. 48. pp. 1362-1368, 2010.
J. Yun et al., “Converting carbon nanofibers to carbon nanoneedles: catalyst splitting and reverse motion”, Nanoscale, vol. 2. pp. 2180-2185, 2010.

2009

D. Kim, Giermann, A. L., and Thompson, C. V., “Solid-state dewetting of patterned thin films”, Applied Physics Letters, vol. 95. 2009.
O. M. Nayfeh, Antoniadis, D. A., Boles, S., Ho, C., and Thompson, C. V., “Formation of Single Tiers of Bridging Silicon Nanowires for Transistor Applications Using Vapor-Liquid-Solid Growth from Short Silicon-on-Insulator Sidewalls”, Small, vol. 5. pp. 2440-2444, 2009.
G. D. Nessim et al., “Low Temperature Synthesis of Vertically Aligned Carbon Nanotubes with Electrical Contact to Metallic Substrates Enabled by Thermal Decomposition of the Carbon Feedstock”, Nano Letters, vol. 9. pp. 3398-3405, 2009.
S. T. Boles, Fitzgerald, E. A., Thompson, C. V., Ho, C. K. F., and Pey, K. L., “Catalyst proximity effects on the growth rate of Si nanowires”, Journal of Applied Physics, vol. 106. 2009.
S. -W. Chang, Chuang, V. P., Boles, S. T., Ross, C. A., and Thompson, C. V., “Densely Packed Arrays of Ultra-High-Aspect-Ratio Silicon Nanowires Fabricated using Block-Copolymer Lithography and Metal-Assisted Etching”, Advanced Functional Materials, vol. 19. pp. 2495-2500, 2009.
J. Leib, Moenig, R., and Thompson, C. V., “Direct Evidence for Effects of Grain Structure on Reversible Compressive Deposition Stresses in Polycrystalline Gold Films”, Physical Review Letters, vol. 102. 2009.
Y. -J. Oh, Ross, C. A., Jung, Y. S., Wang, Y., and Thompson, C. V., “Cobalt Nanoparticle Arrays made by Templated Solid-State Dewetting”, Small, vol. 5. pp. 860-865, 2009.
H. L. Leong, Gan, C. L., Thompson, C. V., Pey, K. L., and Li, H. Y., “Electromigration-induced bond improvement for three-dimensional integrated circuits”, Applied Physics Letters, vol. 94. 2009.
S. T. Boles, Thompson, C. V., and Fitzgerald, E. A., “Influence of indium and phosphine on Au-catalyzed InP nanowire growth on Si substrates”, Journal of Crystal Growth, vol. 311. pp. 1446-1450, 2009.
H. L. Leong, Gan, C. L., Made, R. I., Thompson, C. V., Pey, K. L., and Li, H. Y., “Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects”, Journal of Applied Physics, vol. 105. 2009.
M. Wang, Chua, S. J., Gao, H., Leib, J. S., and Thompson, C. V., “A Study on Morphology Control of ZnO Electrodeposited on Au Surface”, Journal of the Electrochemical Society, vol. 156. pp. D517 - D520, 2009.
W. A. Sasangka, Gan, C. L., Thompson, C. V., Choi, W. K., and Wei, J., Effect of Bonding and Aging Temperatures on Bond Strengths of Cu with 75Sn25In Solders. 2009.

2008

Y. Li, Guo, Q., Kalb, J. A., and Thompson, C. V., “Matching Glass-Forming Ability with the Density of the Amorphous Phase”, Science, vol. 322. pp. 1816-1819, 2008.
Q. Guo et al., “Crystallization-induced stress in thin phase change films of different thicknesses”, Applied Physics Letters, vol. 93. 2008.
W. K. Choi, Liew, T. H., Dawood, M. K., Smith, H. I., Thompson, C. V., and Hong, M. H., “Synthesis of Silicon Nanowires and Nanofin Arrays Using Interference Lithography and Catalytic Etching”, Nano Letters, vol. 8. pp. 3799-3802, 2008.
G. D. Nessim et al., “Tuning of Vertically-Aligned Carbon Nanotube Diameter and Areal Density through Catalyst Pre-Treatment”, Nano Letters, vol. 8. pp. 3587-3593, 2008.
J. A. Kalb, Guo, Q., Zhang, X., Li, Y., Sow, C., and Thompson, C. V., “Phase-Change Materials in Optically Triggered Microactuators”, Journal of Microelectromechanical Systems, vol. 17. pp. 1094-1103, 2008.
F. L. Wei et al., “Electromigration-induced extrusion failures in Cu/low-k interconnects”, Journal of Applied Physics, vol. 104. 2008.
F. L. Wei, Hau-Riege, C. S., Marathe, A. P., and Thompson, C. V., “Effects of active atomic sinks and reservoirs on the reliability of Cu/low-k interconnects”, Journal of Applied Physics, vol. 103. 2008.
J. Oh and Thompson, C. V., “Selective barrier perforation in porous alumina anodized on substrates”, Advanced Materials, vol. 20. p. 1368 - +, 2008.
W. K. Choi et al., “A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon”, Small, vol. 4. pp. 330-333, 2008.
R. Tadepalli, Turner, K. T., and Thompson, C. V., “Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test”, Journal of the Mechanics and Physics of Solids, vol. 56. pp. 707-718, 2008.
Z. -S. Choi, Moenig, R., and Thompson, C. V., “Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects”, Journal of Materials Research, vol. 23. pp. 383-391, 2008.
R. Tadepalli, Turner, K. T., and Thompson, C. V., “Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds”, Acta Materialia, vol. 56. pp. 438-447, 2008.
C. V. Thompson, Using line-length effects to optimize circuit-level reliability. 2008.
C. V. Thompson, Carbon nanotubes as interconnects: Emerging technology and potential reliability issues. 2008.

2007

H. L. Leong, Gan, C. L., Thompson, C. V., Pey, K. L., and Li, H. Y., “Application of contact theory to metal-metal bonding of silicon wafers”, Journal of Applied Physics, vol. 102. 2007.
Z. -S. Choi, Moenig, R., and Thompson, C. V., “Activation energy and prefactor for surface electromigration and void drift in Cu interconnects”, Journal of Applied Physics, vol. 102. 2007.
Z. -S. Choi, Monig, R., and Thompson, C. V., “Dependence of the electromigration flux on the crystallographic orientations of different grains in polycrystalline copper interconnects”, Applied Physics Letters, vol. 90. 2007.
C. W. Chang, Thompson, C. V., Gan, C. L., Pey, K. L., Choi, W. K., and Lim, Y. K., “Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects”, Applied Physics Letters, vol. 90. 2007.
S. M. Alam, Gan, C. L., Thompson, C. V., and Troxel, D. E., “Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations”, Microelectronics Journal, vol. 38. pp. 463-473, 2007.
R. Tadepalli and Thompson, C. V., “Formation of Cu-Cu interfaces with ideal adhesive strengths via room temperature pressure bonding in ultrahigh vacuum”, Applied Physics Letters, vol. 90. 2007.
R. Krishnan and Thompson, C. V., “Monodomain high-aspect-ratio 2D and 3D ordered porous alumina structures with independently controlled pore spacing and diameter”, Advanced Materials, vol. 19. p. 988 - +, 2007.
K. Y. Zang, Wang, Y. D., Wang, L. S., Tripathy, S., Chua, S. J., and Thompson, C. V., “Nanoheteroepitaxy of GaN on a nanopore array of Si(111) surface”, Thin Solid Films, vol. 515. pp. 4505-4508, 2007.
H. Li et al., “Charge-trapping effects caused by ammonia in carbon nanotubes”, Journal of Nanoscience and Nanotechnology, vol. 7. pp. 335-338, 2007.

2006

C. -W. Pao, Srolovitz, D. J., and Thompson, C. V., “Effects of surface defects on surface stress of Cu(001) and Cu(111)”, Physical Review B, vol. 74. 2006.
C. W. Chang, Choi, Z. S., Thompson, C. V., Gan, C. L., Choi, W. K., and Hwang, N., “Electromigration resistance in a short three-contact interconnect tree”, Journal of Applied Physics, vol. 99. 2006.
K. Y. Zang, Wang, Y. D., Chua, S. J., Wang, L. S., Tripathy, S., and Thompson, C. V., “Nanoheteroepitaxial lateral overgrowth of GaN on nanoporous Si(111)”, Applied Physics Letters, vol. 88. 2006.
Z. -S. Choi, Monig, R., Thompson, C. V., and Burns, M., “Kinetics of void drift in copper interconnects”, in Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects, vol. 914, 2006, pp. 363-368.

2005

C. Friesen and Thompson, C. V., “Comment on "Compressive stress in polycrystalline Volmer-Weber films"”, Physical Review Letters, vol. 95. 2005.
T. Trimble et al., “Anion adsorption induced reversal of coherency strain”, Physical Review Letters, vol. 95. 2005.
H. Q. Le et al., “Growth of single crystal ZnO nanorods on GaN using an aqueous solution method”, Applied Physics Letters, vol. 87. 2005.
S. M. Alam, Gan, C. L., Wei, F. L., Thompson, C. V., and Troxel, D. E., “Circuit-level reliability requirements for Cu metallization”, Ieee Transactions on Device and Materials Reliability, vol. 5. pp. 522-531, 2005.
S. C. Seel and Thompson, C. V., “Piezoresistive microcantilevers for in situ stress measurements during thin film deposition”, Review of Scientific Instruments, vol. 76. 2005.
R. Krishnan, Nguyen, H. Q., Thompson, C. V., Choi, W. K., and Foo, Y. L., “Wafer-level ordered arrays of aligned carbon nanotubes with controlled size and spacing on silicon”, Nanotechnology, vol. 16. pp. 841-845, 2005.
A. L. Giermann and Thompson, C. V., “Solid-state dewetting for ordered arrays of crystallographically oriented metal particles”, Applied Physics Letters, vol. 86. 2005.
K. Y. Zang, Chua, S. J., Thompson, C. V., Wang, L. S., Tripathy, S., and Chow, S. Y., “The effect of periodic silane burst on the properties of GaN on Si(III) substrates”, in Gan, Ain, Inn and Their Alloys, vol. 831, 2005, pp. 221-226.
S. M. Alam, Wei, F. L., Gan, C. L., Thompson, C. V., and Troxel, D. E., Electromigration reliability comparison of Cu and Al interconnects. 2005.
Z. S. Choi et al., “Multi-via electromigration test structures for identification and characterization of different failure mechanisms”, in Materials, Technology and Reliability of Advanced Interconnects-2005, vol. 863, 2005, pp. 271-276.

2004

T. J. Zhu, Lu, L., and Thompson, C. V., “Growth and properties of (001)-oriented Pb(Zr0.52Ti0.48)O-3/LaNiO3 films on Si(001) substrates with TiN buffer layers”, Journal of Crystal Growth, vol. 273. pp. 172-178, 2004.
K. Y. Zang, Wang, L. S., Chua, S. J., and Thompson, C. V., “Structural analysis of metalorganic chemical vapor deposited AlN nucleation layers on Si(111)”, Journal of Crystal Growth, vol. 268. pp. 515-520, 2004.
C. Friesen and Thompson, C. V., “Correlation of stress and atomic-scale surface roughness evolution during intermittent homoepitaxial growth of (111)-oriented Ag and Cu”, Physical Review Letters, vol. 93. 2004.
J. Jia, Li, M., and Thompson, C. V., “Amorphization of silicon by femtosecond laser pulses”, Applied Physics Letters, vol. 84. pp. 3205-3207, 2004.
C. Friesen, Seel, S. C., and Thompson, C. V., “Reversible stress changes at all stages of Volmer-Weber film growth”, Journal of Applied Physics, vol. 95. pp. 1011-1020, 2004.
K. P. Liew, Bernstein, R. A., and Thompson, C. V., “Stress development and relaxation during reactive film formation of Ni2Si”, Journal of Materials Research, vol. 19. pp. 676-680, 2004.
S. M. Alam, Wei, F., Gan, C. L., Thompson, C. V., and Troxel, D. E., Impact of non-blocking vias on electromigration and circuit-level reliability assessments of Cu interconnects. 2004.
C. W. Chang, Gan, C. L., Thompson, C. V., Pey, K. L., Choi, W. K., and Hwang, N., “Mortality dependence of Cu dual damascene interconnects on adjacent segment”, in Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2004, vol. 812, 2004, pp. 339-344.
A. L. Giermann, Thompson, C. V., and Smith, H. I., “Templated formation of ordered metallic nano-particle arrays”, in Nanoparticles and Nanowire Building Blocks-Synthesis, Processing, Characterization and Theory, vol. 818, 2004, pp. 37-42.
S. M. Alam, Lip, G. C., Thompson, C. V., and Troxel, D. E., Circuit level reliability analysis of Cu interconnects. 2004.
C. V. Thompson, Gan, C. L., Alam, S. M., and Troxel, D. E., Experiments and models for circuit-level assessment of the reliability of Cu metallization. 2004.
Z. S. Choi et al., “Fatal void size comparisons in via-below and via-above Cu dual-damascene interconnects”, in Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2004, vol. 812, 2004, pp. 373-378.

2003

F. M. Ross, Thompson, C. V., Chiang, T., and Sawin, H. H., “Ion-induced chemical vapor deposition of copper films with nanocellular microstructures”, Applied Physics Letters, vol. 83. pp. 1225-1227, 2003.
C. L. Gan, Thompson, C. V., Pey, K. L., and Choi, W. K., “Experimental characterization and modeling of the reliability of three-terminal dual-damascene Cu interconnect trees”, Journal of Applied Physics, vol. 94. pp. 1222-1228, 2003.
S. C. Seel and Thompson, C. V., “Tensile stress generation during island coalescence for variable island-substrate contact angle”, Journal of Applied Physics, vol. 93. pp. 9038-9042, 2003.
S. M. Alam, Troxel, D. E., and Thompson, C. V., “Layout-specific circuit evaluation in 3-D integrated circuits”, Analog Integrated Circuits and Signal Processing, vol. 35. pp. 199-205, 2003.
S. K. Donthu, Vora, M. M., Lahiri, S. K., Thompson, C. V., and Yi, S., “Activation energy determination for recrystallization in electroplated-copper films using differential scanning calorimetry”, Journal of Electronic Materials, vol. 32. pp. 531-534, 2003.
C. L. Gan, Thompson, C. V., Pey, K. L., Choi, W. K., Chang, C. W., and Gu, Q., Effect of current distribution on the reliability of multi-terminal Cu dual-damascene interconnect trees. 2003.
K. Y. Zang, Chua, S. J., Wang, L. S., and Thompson, C. V., “Evolution of AlN buffer layers on silicon and effects on the properties of epitaxial GaN films”, in 5th International Conference on Nitride Semiconductors (icns-5), Proceedings, 2003, pp. 2067-2071.
C. L. Gan, Thompson, C. V., Pey, K. L., Choi, W. K., Chang, C. W., and Guo, Q., “Experimental characterization of the reliability of multi-terminal dual-damascene copper interconnect trees”, in Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2003, vol. 766, 2003, pp. 121-126.
A. R. Takahashi, Thompson, C. V., and Carter, C., “Metallic island coalescence: Molecular dynamics simulations of boundary formation and tensile strain in polycrystalline thin films”, in Multiscale Phenomena in Materials-Experiments and Modeling Related to Mechanical Behavior, vol. 779, 2003, pp. 97-102.
R. Tadepalli and Thompson, C. V., Quantitative characterization and process optimization of low-temperature bonded copper interconnects for 3-D integrated circuits. 2003.

2002

C. Friesen and Thompson, C. V., “Reversible stress relaxation during precoalescence interruptions of Volmer-Weber thin film growth”, Physical Review Letters, vol. 89. 2002.
S. M. Alam, Troxel, D. E., and Thompson, C. V., A comprehensive layout methodology and layout-specific circuit analyses for three-dimensional integrated circuits. 2002.
C. L. Gan et al., Contrasting failure characteristics of different levels of Cu dual-damascene metallization. 2002.
M. J. Kobrinsky and Thompson, C. V., “Dominant inelastic mechanisms in FCC metallic thin films and lines”, in Stress-Induced Phenomena in Metallization, vol. 612, 2002, pp. 205-216.
C. L. Gan et al., “Experimental characterization of the reliability of 3-terminal dual-damascene copper interconnect trees”, in Silicon Materials-Processing, Characterization and Reliability, vol. 716, 2002, pp. 431-436.
J. Zhao, Lu, L., Thompson, C. V., Lu, Y. F., and Song, W. D., “Growth of (001)-oriented PZT thin films on amorphous SiO2 by pulsed laser deposition”, in Second International Symposium on Laser Precision Microfabrication, vol. 4426, 2002, pp. 221-224.
F. Wei et al., “Length effects on the reliability of dual-damascene Cu interconnects”, in Silicon Materials-Processing, Characterization and Reliability, vol. 716, 2002, pp. 645-650.

2001

C. L. Gan et al., “Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization”, Applied Physics Letters, vol. 79. pp. 4592-4594, 2001.
S. A. Lammert, Plass, W. R., Thompson, C. V., and Wise, M. B., “Design, optimization and initial performance of a toroidal rf ion trap mass spectrometer”, International Journal of Mass Spectrometry, vol. 212. pp. 25-40, 2001.
M. J. Kobrinsky, Dehm, G., Thompson, C. V., and Arzt, E., “Effects of thickness on the characteristic length scale of dislocation plasticity in Ag thin films”, Acta Materialia, vol. 49. pp. 3597-3607, 2001.
C. V. Thompson and Wise, M. B., “Process monitoring by direct sampling ion trap mass spectrometry.”, Abstracts of Papers of the American Chemical Society, vol. 222. pp. U109 - U109, 2001.
C. S. Hau-Riege and Thompson, C. V., “Electromigration in Cu interconnects with very different grain structures”, Applied Physics Letters, vol. 78. pp. 3451-3453, 2001.
J. A. Floro et al., “The dynamic competition between stress generation and relaxation mechanisms during coalescence of Volmer-Weber thin films”, Journal of Applied Physics, vol. 89. pp. 4886-4897, 2001.
J. Zhao, Lu, L., Thompson, C. V., Lu, Y. F., and Song, W. D., “Preparation of (001)-oriented PZT thin films on silicon wafers using pulsed laser deposition”, Journal of Crystal Growth, vol. 225. pp. 173-177, 2001.
C. V. Thompson and Wise, M. B., “Direct Sampling Ion Trap Mass Spectrometry: A simple approach to quality field analysis.”, Abstracts of Papers of the American Chemical Society, vol. 221. pp. U462 - U462, 2001.
W. R. Fayad, Andleigh, V. K., and Thompson, C. V., “Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures”, Journal of Materials Research, vol. 16. pp. 413-416, 2001.
S. P. Hau-Riege and Thompson, C. V., “Experimental characterization and modeling of the reliability of interconnect trees”, Journal of Applied Physics, vol. 89. pp. 601-609, 2001.
M. J. Kobrinsky, Thompson, C. V., and Gross, M. E., “Diffusional creep in damascene Cu lines”, Journal of Applied Physics, vol. 89. pp. 91-98, 2001.
C. S. Hau-Riege, Hau-Riege, S. P., and Thompson, C. V., “Simulation of microstructural evolution induced by scanned laser annealing of metallic interconnects”, Journal of Electronic Materials, vol. 30. pp. 11-16, 2001.
C. V. Thompson, “Grain growth and evolution of other cellular structures”, Solid State Physics: Advances in Research and Applications, Vol 55, vol. 55. pp. 269-314, 2001.
M. J. Kobrinsky, Gross, M. E., and Thompson, C. V., “Mechanical properties of damascene Cu lines during thermal cycling”, in Advanced Metallization Conference 2000 (amc 2000), 2001, pp. 439-445.
W. H. Griest, Wise, M. B., Hart, K. J., Lammert, S. A., Thompson, C. V., and Vass, A. A., “Biological agent detection and identification by the block II chemical biological mass spectrometer”, Field Analytical Chemistry and Technology, vol. 5. pp. 177-184, 2001.

2000

S. C. Seel, Thompson, C. V., Hearne, S. J., and Floro, J. A., “Tensile stress evolution during deposition of Volmer-Weber thin films”, Journal of Applied Physics, vol. 88. pp. 7079-7088, 2000.
S. P. Hau-Riege and Thompson, C. V., “Electromigration saturation in a simple interconnect tree”, Journal of Applied Physics, vol. 88. pp. 2382-2385, 2000.
W. R. Fayad, Kobrinsky, M. J., and Thompson, C. V., “Analytic model for the development of bamboo microstructures in thin film strips undergoing normal grain growth”, Physical Review B, vol. 62. pp. 5221-5227, 2000.
S. P. Hau-Riege and Thompson, C. V., “The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects”, Journal of Materials Research, vol. 15. pp. 1797-1802, 2000.
C. S. Hau-Riege and Thompson, C. V., “Use of scanned laser annealing to control the bamboo grain length of Cu interconnects”, Applied Physics Letters, vol. 77. pp. 352-354, 2000.
C. S. Hau-Riege and Thompson, C. V., “The effects of microstructural transitions at width transitions on interconnect reliability”, Journal of Applied Physics, vol. 87. pp. 8467-8472, 2000.
M. J. Kobrinsky and Thompson, C. V., “Activation volume for inelastic deformation in polycrystalline Ag thin films”, Acta Materialia, vol. 48. pp. 625-633, 2000.
S. P. Hau-Riege and Thompson, C. V., “In situ transmission electron microscope studies of the kinetics of abnormal grain growth in electroplated copper films”, Applied Physics Letters, vol. 76. pp. 309-311, 2000.
M. J. Kobrinsky and Thompson, C. V., “Activation volume for inelastic deformation in polycrystalline Ag films at low temperatures”, in Thin Films-Stresses and Mechanical Properties Viii, vol. 594, 2000, pp. 57-62.
C. V. Thompson, “Structure evolution during processing of polycrystalline films”, Annual Review of Materials Science, vol. 30. pp. 159-190, 2000.

1999

V. T. Srikar and Thompson, C. V., “Dislocation pile-ups as sites for formation of electromigration-induced transgranular slit-like voids in Al interconnects”, Scripta Materialia, vol. 42. pp. 97-102, 1999.
V. K. Andleigh, Srikar, V. T., Park, Y. J., and Thompson, C. V., “Mechanism maps for electromigration-induced failure of metal and alloy interconnects”, Journal of Applied Physics, vol. 86. pp. 6737-6745, 1999.
C. S. Hau-Riege and Thompson, C. V., “Microstructural evolution induced by scanned laser annealing in Al interconnects”, Applied Physics Letters, vol. 75. pp. 1464-1466, 1999.
J. Greiser, Muller, D., Mullner, P., Thompson, C. V., and Arzt, E., “Growth of giant grains in silver thin films”, Scripta Materialia, vol. 41. pp. 709-714, 1999.
H. Gao, Zhang, L., Nix, W. D., Thompson, C. V., and Arzt, E., “Crack-like grain-boundary diffusion wedges in thin metal films”, Acta Materialia, vol. 47. pp. 2865-2878, 1999.
S. P. Riege and Thompson, C. V., “Modeling of texture evolution in copper interconnects annealed in trenches”, Scripta Materialia, vol. 41. pp. 403-408, 1999.
C. V. Thompson, “On the grain size and coalescence stress resulting from nucleation and growth processes during formation of polycrystalline thin films”, Journal of Materials Research, vol. 14. pp. 3164-3168, 1999.
J. J. Clement, Riege, S. P., Cvijetic, R., and Thompson, C. V., “Methodology for electromigration critical threshold design rule evaluation”, Ieee Transactions on Computer-Aided Design of Integrated Circuits and Systems, vol. 18. pp. 576-581, 1999.
W. Fayad, Thompson, C. V., and Frost, H. J., “Steady-state grain-size distributions resulting from grain growth in two dimensions”, Scripta Materialia, vol. 40. pp. 1199-1204, 1999.
S. P. Riege, Thompson, C. V., and Frost, H. J., “Simulation of the influence of particles on grain structure evolution in two-dimensional systems and thin films”, Acta Materialia, vol. 47. pp. 1879-1887, 1999.
Y. J. Park, Andleigh, V. K., and Thompson, C. V., “Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects”, Journal of Applied Physics, vol. 85. pp. 3546-3555, 1999.
M. B. Wise, Thompson, C. V., Merriweather, R., Smith, R. R., and Guerin, M. R., “On-site analysis of VOCs in water and soil by direct sampling ion trap mass spectrometry.”, Abstracts of Papers of the American Chemical Society, vol. 217. pp. U136 - U136, 1999.
Y. C. Joo, Thompson, C. V., Baker, S. P., and Arzt, E., “Electromigration proximity effects of two neighboring fast-diffusion segments in single-crystal aluminum lines”, Journal of Applied Physics, vol. 85. pp. 2108-2113, 1999.
V. T. Srikar and Thompson, C. V., “Diffusion and electromigration of copper in SiO2-passivated single-crystal aluminum interconnects”, Applied Physics Letters, vol. 74. pp. 37-39, 1999.
V. K. Andleigh, Park, Y. J., and Thompson, C. V., “Interconnect failure mechanism maps for different metallization materials and processes”, in Materials Reliability in Microelectronics Ix, vol. 563, 1999, pp. 59-64.
Y. C. Joo, Baker, S. P., Arzt, E., and Thompson, C. V., “Model studies of electromigration using indented single-crystal aluminum lines”, in Stress Induced Phenomena in Metallization, vol. 491, 1999, pp. 100-111.
C. V. Thompson, Hau-Riege, S. P., and Andleigh, V. K., “Modeling and experimental characterization of electromigration in interconnect trees”, in Stress Induced Phenomena in Metallization, vol. 491, 1999, pp. 62-73.

1998

M. J. Kobrinsky and Thompson, C. V., “The thickness dependence of the flow stress of capped and uncapped polycrystalline Ag thin films”, Applied Physics Letters, vol. 73. pp. 2429-2431, 1998.
S. P. Riege, Thompson, C. V., and Clement, J. J., “A hierarchical reliability analysis for circuit design evaluation”, Ieee Transactions on Electron Devices, vol. 45. pp. 2254-2257, 1998.
A. Gouldstone, Shen, Y. L., Suresh, S., and Thompson, C. V., “Evolution of stresses in passivated and unpassivated metal interconnects”, Journal of Materials Research, vol. 13. pp. 1956-1966, 1998.
V. T. Srikar and Thompson, C. V., “The effect of Al3Ti capping layers on electromigration in single-crystal aluminum interconnects”, Applied Physics Letters, vol. 72. pp. 2677-2679, 1998.
B. D. Knowlton and Thompson, C. V., “Simulation of the temperature and current density scaling of the electromigration-limited reliability of near-bamboo interconnects”, Journal of Materials Research, vol. 13. pp. 1164-1170, 1998.
C. V. Thompson, “Grain growth in polycrystalline thin films of semiconductors”, Interface Science, vol. 6. pp. 85-93, 1998.
V. T. Srikar and Thompson, C. V., “Diffusion and electromigration of Cu in single crystal Al interconnects”, in Materials Reliability in Microelectronics Viii, vol. 516, 1998, pp. 71-75.
S. P. Riege, Thompson, C. V., and Frost, H. J., The effect of particle-pinning on grain size distributions in 2D simulations of grain growth. 1998.
C. V. Thompson and Wise, M. B., “Effects of Silcosteel (R) transfer line on the sampling of volatile organic compounds”, Field Analytical Chemistry and Technology, vol. 2. pp. 309-314, 1998.
D. Weiss, Mullner, P., Thompson, C. V., and Arzt, E., Grain growth in dispersion hardened copper films. 1998.
W. Fayad, Andleigh, V., Thompson, C. V., and Frost, H. J., “Grain structure statistics in As-patterned and annealed interconnects”, in Materials Reliability in Microelectronics Viii, vol. 516, 1998, pp. 159-164.
S. P. Riege, Andleigh, V., Thompson, C. V., and Frost, H. J., “Modeling of grain structure evolution and its impact on the reliability of Al(Cu) thin film interconnects”, in Semiconductor Process and Device Performance Modelling, vol. 490, 1998, pp. 219-224.
H. J. Frost and Thompson, C. V., Thin film microstructures produced by nucleation and growth-to-impingement. 1998.

1997

T. P. Chiang, Sawin, H. H., and Thompson, C. V., “Surface kinetic study of ion-induced chemical vapor deposition of copper for focused ion beam applications”, Journal of Vacuum Science & Technology a-Vacuum Surfaces and Films, vol. 15. pp. 3104-3114, 1997.
Y. J. Park and Thompson, C. V., “The effects of the stress dependence of atomic diffusivity on stress evolution due to electromigration”, Journal of Applied Physics, vol. 82. pp. 4277-4281, 1997.
T. P. Chiang, Sawin, H. H., and Thompson, C. V., “Ion-induced chemical vapor deposition of high purity Cu films at room temperature using a microwave discharge H atom beam source”, Journal of Vacuum Science & Technology a-Vacuum Surfaces and Films, vol. 15. pp. 2677-2686, 1997.
Y. C. Joo and Thompson, C. V., “Electromigration-induced transgranular failure mechanisms in single-crystal aluminum interconnects”, Journal of Applied Physics, vol. 81. pp. 6062-6072, 1997.
B. D. Knowlton, Clement, J. J., and Thompson, C. V., “Simulation of the effects of grain structure and grain growth on electromigration and the reliability of interconnects”, Journal of Applied Physics, vol. 81. pp. 6073-6080, 1997.
M. B. Wise, Thompson, C. V., Merriweather, R., and Guerin, M. R., “Review of direct MS analysis of environmental samples”, Field Analytical Chemistry and Technology, vol. 1. pp. 251-276, 1997.

1996

C. V. Thompson and Knowlton, B. D., “Designing circuits and processes to optimize performance and reliability: Metallurgy meets TCAD”, Microelectronics and Reliability, vol. 36. pp. 1683-1690, 1996.
C. V. Thompson, “What\textquoterights up? Part deux”, Mrs Bulletin, vol. 21. pp. 3-4, 1996.
H. J. Frost and Thompson, C. V., “Computer simulation of grain growth”, Current Opinion in Solid State & Materials Science, vol. 1. pp. 361-368, 1996.
R. CAREL, Thompson, C. V., and Frost, H. J., “Computer simulation of strain energy effects vs surface and interface energy effects on grain growth in thin films”, Acta Materialia, vol. 44. pp. 2479-2494, 1996.
C. V. Thompson and CAREL, R., “Stress and grain growth in thin films”, Journal of the Mechanics and Physics of Solids, vol. 44. pp. 657-673, 1996.
G. Bochi, Ballentine, C. A., Inglefield, H. E., Thompson, C. V., and OHandley, R. C., “Perpendicular magnetization and surface magnetoelastic anisotropy in epitaxial Cu/Ni/Cu(001)”, Journal of Applied Physics, vol. 79. pp. 5845-5847, 1996.
A. L. Greer, Samwer, K., and Thompson, C. V., “Papers presented at the European Materials Research Society 1995 Spring Conference, Symposium E: Structure and Properties of Metallic Thin Films and Multilayers, Strasbourg, France, May 22-26, 1995 - Preface”, Thin Solid Films, vol. 275. pp. R9 - R9, 1996.
H. E. Inglefield, Bochi, G., Ballentine, C. A., OHandley, R. C., and Thompson, C. V., “Perpendicular magnetic anisotropy in epitaxial Cu/Ni/Cu/Si(001)”, Thin Solid Films, vol. 275. pp. 155-158, 1996.
J. Funatsu, Thompson, C. V., MELNGAILIS, J., and Walpole, J. N., “Laser assisted focused-ion-beam-induced deposition of copper”, Journal of Vacuum Science & Technology B, vol. 14. pp. 179-180, 1996.
G. Bochi, Ballentine, C. A., Inglefield, H. E., Thompson, C. V., and OHandley, R. C., “Evidence for strong surface magnetoelastic anisotropy in epitaxial Cu/Ni/Cu(001) sandwiches”, Physical Review B, vol. 53. pp. R1729 - R1732, 1996.
C. V. Thompson, “What\textquoterights up?”, Mrs Bulletin, vol. 21. pp. 4-4, 1996.
C. V. Thompson and CAREL, R., “Grain growth and texture evolution in thin films”, in Grain Growth in Polycrystalline Materials Ii, Pts 1 and 2, vol. 204-, 1996, pp. 83-98.
S. C. Seel, CAREL, R., and Thompson, C. V., “Texture maps for orientation evolution during grain growth in thin films”, in Polycrystalline Thin Films: Structure, Texture, Properties, and Applications Ii, vol. 403, 1996, pp. 63-70.

1995

G. Bochi et al., “PERPENDICULAR MAGNETIC-ANISOTROPY, DOMAINS, AND MISFIT STRAIN IN EPITAXIAL NI/CU1-XNIX/CU/SI (001) THIN-FILMS”, Physical Review B, vol. 52. pp. 7311-7321, 1995.
J. J. CLEMENT and Thompson, C. V., “MODELING ELECTROMIGRATION-INDUCED STRESS EVOLUTION IN CONFINED METAL LINES”, Journal of Applied Physics, vol. 78. pp. 900-904, 1995.
C. V. Thompson and CAREL, R., “TEXTURE DEVELOPMENT IN POLYCRYSTALLINE THIN-FILMS”, Materials Science and Engineering B-Solid State Materials for Advanced Technology, vol. 32. pp. 211-219, 1995.
J. S. RO, Thompson, C. V., and MELNGAILIS, J., “MICROSTRUCTURE OF GOLD GROWN BY ION-INDUCED DEPOSITION”, Thin Solid Films, vol. 258. pp. 333-335, 1995.
B. D. Knowlton, Clement, J. J., Frank, R. I., and Thompson, C. V., “Coupled stress evolution in polygranular clusters and bamboo segments in near-bamboo interconnects”, in Materials Reliability in Microelectronics V, vol. 391, 1995, pp. 189-196.
B. D. Knowlton, Frank, R. I., and Thompson, C. V., “The effect of Cu distribution on post-patterning grain growth and reliability of Al-1\% Cu interconnects”, in Materials Reliability in Microelectronics V, vol. 391, 1995, pp. 361-366.
J. J. Clement, Lloyd, J. R., and Thompson, C. V., “Failure in tungsten-filled via structures”, in Materials Reliability in Microelectronics V, vol. 391, 1995, pp. 423-428.
K. Tatah, Fukumoto, A., and Thompson, C. V., Laser ablation forward deposition of metal lines for electrical interconnect repair. 1995.
H. E. INGLEFIELD, Bochi, G., BALLENTINE, C. A., OHANDLEY, R. C., and Thompson, C. V., “Misfit strain relief beyond the critical thickness using curvature measurements and in situ characterization of the magneto-optic Kerr effect”, in Thin Films: Stresses and Mechanical Properties V, vol. 356, 1995, pp. 265-270.
C. V. Thompson, Joo, Y. C., and Knowlton, B. D., “Modeling of the structure and reliability of near-bamboo interconnects”, in Materials Reliability in Microelectronics V, vol. 391, 1995, pp. 163-176.

1994

Y. C. JOO and Thompson, C. V., “ANALYTIC MODEL FOR THE GRAIN STRUCTURES OF NEAR-BAMBOO INTERCONNECTS”, Journal of Applied Physics, vol. 76. pp. 7339-7346, 1994.
J. A. FLORO, Thompson, C. V., CAREL, R., and BRISTOWE, P. D., “COMPETITION BETWEEN STRAIN AND INTERFACE ENERGY DURING EPITAXIAL GRAIN-GROWTH IN AG FILMS ON NI(001)”, Journal of Materials Research, vol. 9. pp. 2411-2424, 1994.
G. Bochi, BALENTINE, C. A., INGLEFIELD, H. E., BOGOMOLOV, S. S., Thompson, C. V., and OHANDLEY, R. C., “MAGNETIC-ANISOTROPY IN EPITAXIAL NI/CU(001) THIN-FILMS - EFFECTS OF MISFIT STRAIN ON PERPENDICULAR MAGNETIC-ANISOTROPY”, Journal of Applied Physics, vol. 75. pp. 6430-6430, 1994.
J. S. RO, Thompson, C. V., and MELNGAILIS, J., “MECHANISM OF ION-BEAM-INDUCED DEPOSITION OF GOLD”, Journal of Vacuum Science & Technology B, vol. 12. pp. 73-77, 1994.
H. J. FROST, HAYASHI, Y., Thompson, C. V., and WALTON, D. T., “THE EFFECT OF VARIABILITY AMONG GRAIN-BOUNDARY ENERGIES ON GRAIN-GROWTH”, in Materials Reliability in Microelectronics Iv, vol. 338, 1994, pp. 295-300.
Y. C. JOO and Thompson, C. V., “ELECTROMIGRATION LIFETIMES OF SINGLE-CRYSTAL ALUMINUM LINES WITH DIFFERENT CRYSTALLOGRAPHIC ORIENTATIONS”, in Materials Reliability in Microelectronics Iv, vol. 338, 1994, pp. 319-324.
J. A. FLORO, CAREL, R., and Thompson, C. V., “ENERGY MINIMIZATION DURING EPITAXIAL GRAIN-GROWTH - STRAIN VS INTERFACIAL ENERGY”, in Mechanisms of Thin Film Evolution, vol. 317, 1994, pp. 419-424.
C. V. Thompson, “GRAIN-GROWTH IN POLYCRYSTALLINE THIN-FILMS”, in Polycrystalline Thin Films: Structure, Texture, Properties and Applications, vol. 343, 1994, pp. 3-12.
H. J. FROST, HAYASHI, Y., Thompson, C. V., and WALTON, D. T., “GRAIN-GROWTH IN THIN-FILMS WITH VARIABLE GRAIN-BOUNDARY ENERGY”, in Mechanisms of Thin Film Evolution, vol. 317, 1994, pp. 485-490.
J. A. FLORO and Thompson, C. V., “MEAN-FIELD ANALYSIS OF ORIENTATION SELECTIVE GRAIN-GROWTH DRIVEN BY INTERFACE-ENERGY ANISOTROPY”, in Polycrystalline Thin Films: Structure, Texture, Properties and Applications, vol. 343, 1994, pp. 65-70.
J. J. CLEMENT, Thompson, C. V., and ENVER, A., “MODELING ELECTROMIGRATION-INDUCED STRESS BUILDUP DUE TO NONUNIFORM TEMPERATURE”, in Materials Reliability in Microelectronics Iv, vol. 338, 1994, pp. 353-360.
H. J. FROST and Thompson, C. V., “MODELING OF MICROSTRUCTURES AND THEIR EFFECT ON INTERCONNECT RELIABILITY”, in Stress-Induced Phenomena in Metallization: Second International Workshop, 1994, pp. 254-269.
R. CAREL, Thompson, C. V., and FROST, H. J., “COMPUTER-SIMULATION OF STRAIN-ENERGY AND SURFACE-ENERGY AND INTERFACE-ENERGY ON GRAIN-GROWTH IN THIN-FILMS”, in Polycrystalline Thin Films: Structure, Texture, Properties and Applications, vol. 343, 1994, pp. 49-54.
H. J. FROST, HAYASHI, Y., Thompson, C. V., and WALTON, D. T., “THE EFFECT OF SOLUTE DRAG ON GRAIN-GROWTH IN THIN-FILMS”, in Mechanisms of Thin Film Evolution, vol. 317, 1994, pp. 431-436.

1993

A. D. DELLARATTA, MELNGAILIS, J., and Thompson, C. V., “FOCUSED-ION BEAM-INDUCED DEPOSITION OF COPPER”, Journal of Vacuum Science & Technology B, vol. 11. pp. 2195-2199, 1993.
J. R. LLOYD and Thompson, C. V., “MATERIALS RELIABILITY IN MICROELECTRONICS”, Mrs Bulletin, vol. 18. pp. 16-16, 1993.
C. V. Thompson and LLOYD, J. R., “ELECTROMIGRATION AND IC INTERCONNECTS”, Mrs Bulletin, vol. 18. pp. 19-25, 1993.
M. B. WISE, GUERIN, M. R., Thompson, C. V., and BUCHANAN, M. V., “DIRECT SAMPLING ION-TRAP MASS-SPECTROMETRY FOR RAPID ENVIRONMENTAL-ANALYSIS”, Abstracts of Papers of the American Chemical Society, vol. 206. p. 2 - ENVR, 1993.
C. V. Thompson and KAHN, H., “EFFECTS OF MICROSTRUCTURE ON INTERCONNECT AND VIA RELIABILITY - MULTIMODAL FAILURE STATISTICS”, Journal of Electronic Materials, vol. 22. pp. 581-587, 1993.
J. A. FLORO and Thompson, C. V., “NUMERICAL-ANALYSIS OF INTERFACE ENERGY-DRIVEN COARSENING IN THIN-FILMS AND ITS CONNECTION TO GRAIN-GROWTH”, Acta Metallurgica Et Materialia, vol. 41. pp. 1137-1147, 1993.
C. V. Thompson, “THE YIELD STRESS OF POLYCRYSTALLINE THIN-FILMS”, Journal of Materials Research, vol. 8. pp. 237-238, 1993.
C. V. Thompson, “TEXTURE EVOLUTION DURING GRAIN-GROWTH IN POLYCRYSTALLINE FILMS”, Scripta Metallurgica Et Materialia, vol. 28. pp. 167-172, 1993.
G. Bochi, BALLENTINE, C. A., INGLEFIELD, H. E., BOGOMOLOV, S. S., Thompson, C. V., and OHANDLEY, R. C., “MAGNETIC-ANISOTROPY IN EPITAXIAL NI/CU (100) THIN-FILMS”, in Magnetic Ultrathin Films: Multilayers and Surfaces, Interfaces and Characterization, vol. 313, 1993, pp. 309-313.
C. V. Thompson, FLORO, J. A., and CAREL, R., MODELING OF GRAIN-GROWTH IN THIN-FILMS. 1993.
C. V. Thompson, “THE ORIGINS OF EPITAXIAL ORIENTATIONS IN THIN-FILMS”, in Evolution of Surface and Thin Film Microstructure, vol. 280, 1993, pp. 307-318.
H. J. FROST, Thompson, C. V., and WALTON, D. T., SIMULATION OF GRAIN-GROWTH IN THIN-FILMS. 1993.
H. E. INGLEFIELD, BALLENTINE, C. A., Bochi, G., BOGOMOLOV, S. S., OHANDLEY, R. C., and Thompson, C. V., “USE OF MAGNETOOPTIC KERR-EFFECT MEASUREMENTS TO STUDY STRAIN AND MISFIT ACCOMMODATION IN THIN-FILMS OF NI/CU (100)”, in Thin Films: Stresses and Mechanical Properties Iv, vol. 308, 1993, pp. 765-770.
C. V. Thompson, “THE EFFECT OF THERMAL HISTORY ON INTERCONNECT RELIABILITY”, in Materials Reliability in Microelectronics Iii, vol. 309, 1993, pp. 383-394.
Y. C. JOO and Thompson, C. V., “EVOLUTION OF ELECTROMIGRATION-INDUCED VOIDS IN SINGLE-CRYSTALLINE ALUMINUM LINES WITH DIFFERENT CRYSTALLOGRAPHIC ORIENTATIONS”, in Materials Reliability in Microelectronics Iii, vol. 309, 1993, pp. 351-356.

1992

D. T. WALTON, FROST, H. J., and Thompson, C. V., “DEVELOPMENT OF NEAR-BAMBOO AND BAMBOO MICROSTRUCTURES IN THIN-FILM STRIPS”, Applied Physics Letters, vol. 61. pp. 40-42, 1992.
E. MA, CLEVENGER, L. A., and Thompson, C. V., “NUCLEATION OF AN INTERMETALLIC AT THIN-FILM INTERFACES - VSI2 CONTRASTED WITH AL3NI”, Journal of Materials Research, vol. 7. pp. 1350-1355, 1992.
C. V. Thompson, “THE MATERIALS SCIENCE OF THIN-FILMS - OHRING,M”, Nature, vol. 357. pp. 292-292, 1992.
H. P. LONGWORTH and Thompson, C. V., “EXPERIMENTAL-STUDY OF ELECTROMIGRATION IN BICRYSTAL ALUMINUM LINES”, Applied Physics Letters, vol. 60. pp. 2219-2221, 1992.
H. J. FROST, Thompson, C. V., and WALTON, D. T., “SIMULATION OF THIN-FILM GRAIN STRUCTURES .2. ABNORMAL GRAIN-GROWTH”, Acta Metallurgica Et Materialia, vol. 40. pp. 779-793, 1992.
E. JIRAN and Thompson, C. V., “CAPILLARY INSTABILITIES IN THIN, CONTINUOUS FILMS”, Thin Solid Films, vol. 208. pp. 23-28, 1992.
C. V. Thompson, “ON THE ROLE OF DIFFUSION IN PHASE SELECTION DURING REACTIONS AT INTERFACES”, Journal of Materials Research, vol. 7. pp. 367-373, 1992.
P. V. EVANS, SMITH, D. A., and Thompson, C. V., “ABSENCE OF ELECTRICAL-ACTIVITY AT HIGH-ANGLE GRAIN-BOUNDARIES IN ZONE-MELT-RECRYSTALLIZED SILICON-ON-INSULATOR FILMS”, Applied Physics Letters, vol. 60. pp. 439-441, 1992.
H. MIURA, MA, E., and Thompson, C. V., INITIAL EVOLUTION OF COBALT SILICIDES IN THE COBALT AMORPHOUS-SILICON THIN-FILM SYSTEM, vol. 230. 1992.
D. T. WALTON, FROST, H. J., and Thompson, C. V., MODELING OF GRAIN-GROWTH IN THIN-FILM STRIPS, vol. 94. 1992.
H. KAHN, Thompson, C. V., and COOPERMAN, S. S., RELIABILITY OF INTERCONNECTS EXHIBITING BIMODAL ELECTROMIGRATION-INDUCED FAILURE DISTRIBUTIONS, vol. 265. 1992.
H. J. FROST, Thompson, C. V., and WALTON, D. T., ABNORMAL GRAIN-GROWTH IN THIN-FILMS DUE TO ANISOTROPY OF FREE-SURFACE ENERGIES, vol. 94. 1992.
E. MA, Thompson, C. V., and CLEVENGER, L. A., A CALORIMETRIC STUDY OF THE KINETICS OF AL3NI NUCLEATION AND GROWTH DURING REACTIONS IN AL/NI THIN-FILMS, vol. 205. 1992.
H. P. LONGWORTH and Thompson, C. V., ELECTROMIGRATION IN BICRYSTAL AL LINES, vol. 265. 1992.
C. V. Thompson, EXPERIMENTAL AND THEORETICAL ASPECTS OF GRAIN-GROWTH IN THIN-FILMS, vol. 94. 1992.

1991

H. MIURA, MA, E., and Thompson, C. V., “INITIAL SEQUENCE AND KINETICS OF SILICIDE FORMATION IN COBALT AMORPHOUS-SILICON MULTILAYER THIN-FILMS”, Journal of Applied Physics, vol. 70. pp. 4287-4294, 1991.
H. KAHN and Thompson, C. V., “EFFECT OF APPLIED MECHANICAL-STRESS ON THE ELECTROMIGRATION FAILURE TIMES OF ALUMINUM INTERCONNECTS”, Applied Physics Letters, vol. 59. pp. 1308-1310, 1991.
A. D. DUBNER, WAGNER, A., MELNGAILIS, J., and Thompson, C. V., “THE ROLE OF THE ION-SOLID INTERACTION IN ION-BEAM-INDUCED DEPOSITION OF GOLD”, Journal of Applied Physics, vol. 70. pp. 665-673, 1991.
H. P. LONGWORTH and Thompson, C. V., “ABNORMAL GRAIN-GROWTH IN ALUMINUM-ALLOY THIN-FILMS”, Journal of Applied Physics, vol. 69. pp. 3929-3940, 1991.
E. MA, Thompson, C. V., and CLEVENGER, L. A., “NUCLEATION AND GROWTH DURING REACTIONS IN MULTILAYER AL/NI FILMS - THE EARLY STAGE OF AL3 NI FORMATION”, Journal of Applied Physics, vol. 69. pp. 2211-2218, 1991.
D. T. WALTON, FROST, H. J., and Thompson, C. V., COMPUTER-SIMULATION OF GRAIN-GROWTH IN THIN-FILM INTERCONNECT LINES, vol. 225. 1991.
H. KAHN and Thompson, C. V., A STATISTICAL CHARACTERIZATION OF ELECTROMIGRATION-INDUCED OPEN FAILURES, vol. 225. 1991.

1990

J. CHO and Thompson, C. V., “ELECTROMIGRATION-INDUCED FAILURES IN INTERCONNECTS WITH BIMODAL GRAIN-SIZE DISTRIBUTIONS”, Journal of Electronic Materials, vol. 19. pp. 1207-1212, 1990.
E. JIRAN and Thompson, C. V., “CAPILLARY INSTABILITIES IN THIN-FILMS”, Journal of Electronic Materials, vol. 19. pp. 1153-1160, 1990.
R. C. CAMMARATA, Thompson, C. V., HAYZELDEN, C., and TU, K. N., “SILICIDE PRECIPITATION AND SILICON CRYSTALLIZATION IN NICKEL IMPLANTED AMORPHOUS-SILICON THIN-FILMS”, Journal of Materials Research, vol. 5. pp. 2133-2138, 1990.
E. MA, Thompson, C. V., CLEVENGER, L. A., and TU, K. N., “SELF-PROPAGATING EXPLOSIVE REACTIONS IN AL/NI MULTILAYER THIN-FILMS”, Applied Physics Letters, vol. 57. pp. 1262-1264, 1990.
H. J. FROST, Thompson, C. V., and WALTON, D. T., “SIMULATION OF THIN-FILM GRAIN STRUCTURES .1. GRAIN-GROWTH STAGNATION”, Acta Metallurgica Et Materialia, vol. 38. pp. 1455-1462, 1990.
L. A. CLEVENGER, Thompson, C. V., DEAVILLEZ, R. R., and MA, E., “NUCLEATION CONTROLLED PHASE SELECTION IN VANADIUM AMORPHOUS-SILICON MULTILAYER THIN-FILMS”, Journal of Vacuum Science & Technology a-Vacuum Surfaces and Films, vol. 8. pp. 1566-1571, 1990.
C. V. Thompson, FLORO, J., and SMITH, H. I., “EPITAXIAL GRAIN-GROWTH IN THIN METAL-FILMS”, Journal of Applied Physics, vol. 67. pp. 4099-4104, 1990.
L. A. CLEVENGER, Thompson, C. V., and TU, K. N., “EXPLOSIVE SILICIDATION IN NICKEL AMORPHOUS-SILICON MULTILAYER THIN-FILMS”, Journal of Applied Physics, vol. 67. pp. 2894-2898, 1990.
R. R. DEAVILLEZ, CLEVENGER, L. A., Thompson, C. V., and TU, K. N., “QUANTITATIVE INVESTIGATION OF TITANIUM AMORPHOUS-SILICON MULTILAYER THIN-FILM REACTIONS”, Journal of Materials Research, vol. 5. pp. 593-600, 1990.
L. A. CLEVENGER and Thompson, C. V., “NUCLEATION-LIMITED PHASE SELECTION DURING REACTIONS IN NICKEL AMORPHOUS-SILICON MULTILAYER THIN-FILMS”, Journal of Applied Physics, vol. 67. pp. 1325-1333, 1990.
H. J. KIM and Thompson, C. V., “THE EFFECTS OF DOPANTS ON SURFACE-ENERGY-DRIVEN SECONDARY GRAIN-GROWTH”, Journal of Applied Physics, vol. 67. pp. 757-767, 1990.
J. A. FLORO and Thompson, C. V., EPITAXIAL GRAIN-GROWTH AND ORIENTATION METASTABILITY IN HETEROEPITAXIAL THIN-FILMS, vol. 187. 1990.
C. V. Thompson, “GRAIN-GROWTH IN THIN-FILMS”, Annual Review of Materials Science, vol. 20. pp. 245-268, 1990.
E. MA, CLEVENGER, L. A., Thompson, C. V., and TU, K. N., KINETIC AND THERMODYNAMIC ASPECTS OF PHASE EVOLUTION IN TI/A-SI MULTILAYER FILMS, vol. 187. 1990.
C. V. Thompson, CLEVENGER, L. A., DEAVILLEZ, R., MA, E., and MIURA, H., KINETICS AND THERMODYNAMICS OF AMORPHOUS SILICIDE FORMATION IN METAL AMORPHOUS-SILICON MULTILAYER THIN-FILMS, vol. 187. 1990.
J. S. IM, LIPMAN, J. D., MIAOULIS, I. N., CHEN, C. K., and Thompson, C. V., NUMERICAL MODELING OF ENERGY-BEAM INDUCED LOCALIZED MELTING OF THIN SI FILMS, vol. 157. 1990.
E. MA, CLEVENGER, L. A., Thompson, C. V., DEAVILLEZ, R. R., and TU, K. N., “STRUCTURAL TRANSITIONS IN TITANIUM AMORPHOUS-SILICON MULTILAYERS”, in Impurities, Defects and Diffusion in Semiconductors: Bulk and Layered Structures, vol. 163, 1990, pp. 961-964.

1989

P. G. BLAUNER, BUTT, Y., RO, J. S., Thompson, C. V., and MELNGAILIS, J., “FOCUSED ION-BEAM INDUCED DEPOSITION OF LOW-RESISTIVITY GOLD-FILMS”, Journal of Vacuum Science & Technology B, vol. 7. pp. 1816-1818, 1989.
R. R. DEAVILLEZ, CLEVENGER, L. A., and Thompson, C. V., “RELAXATION PHENOMENA IN EVAPORATED AMORPHOUS-SILICON FILMS”, Journal of Materials Research, vol. 4. pp. 1057-1059, 1989.
J. E. PALMER, BURNS, G., FONSTAD, C. G., and Thompson, C. V., “EFFECT OF AS4 OVERPRESSURE ON INITIAL GROWTH OF GALLIUM-ARSENIDE ON SILICON BY MOLECULAR-BEAM EPITAXY”, Applied Physics Letters, vol. 55. pp. 990-992, 1989.
F. Spaepen and Thompson, C. V., “CALORIMETRIC STUDIES OF REACTIONS IN THIN-FILMS AND MULTILAYERS”, Applied Surface Science, vol. 38. pp. 1-12, 1989.
K. R. COFFEY, CLEVENGER, L. A., Barmak, K., RUDMAN, D. A., and Thompson, C. V., “EXPERIMENTAL-EVIDENCE FOR NUCLEATION DURING THIN-FILM REACTIONS”, Applied Physics Letters, vol. 55. pp. 852-854, 1989.
J. CHO and Thompson, C. V., “GRAIN-SIZE DEPENDENCE OF ELECTROMIGRATION-INDUCED FAILURES IN NARROW INTERCONNECTS”, Applied Physics Letters, vol. 54. pp. 2577-2579, 1989.
C. V. Thompson, JENKINS, R. A., and HIGGINS, C. E., “A THERMAL-DESORPTION METHOD FOR THE DETERMINATION OF NICOTINE IN INDOOR ENVIRONMENTS”, Environmental Science & Technology, vol. 23. pp. 429-435, 1989.
H. A. ATWATER, Thompson, C. V., and KIM, H. J., “THE ROLE OF POINT-DEFECTS IN ION-BOMBARDMENT-ENHANCED AND DOPANT-ENHANCED GRAIN-GROWTH IN SILICON THIN-FILMS”, Nuclear Instruments & Methods in Physics Research Section B-Beam Interactions with Materials and Atoms, vol. 39. pp. 64-67, 1989.
J. M. PHILLIPS, PALMER, J. E., HECKER, N. E., and Thompson, C. V., THE EFFECT OF ANNEALING ON THE STRUCTURE OF EPITAXIAL CAF2 FILMS ON SI(100), vol. 148. 1989.
L. A. CLEVENGER, Thompson, C. V., DEAVILLEZ, R. R., and TU, K. N., KINETICS AND THERMODYNAMICS OF AMORPHOUS SILICIDE FORMATION IN NICKEL AMORPHOUS-SILICON MULTILAYER THIN-FILMS, vol. 148. 1989.
P. G. BLAUNER, RO, J. S., BUTT, Y., Thompson, C. V., and MELNGAILIS, J., THE MICROSTRUCTURE OF GOLD-FILMS WRITTEN BY FOCUSED ION-BEAM INDUCED DEPOSITION, vol. 129. 1989.

1988

H. A. ATWATER, Thompson, C. V., and SMITH, H. I., “MECHANISMS FOR CRYSTALLOGRAPHIC ORIENTATION IN THE CRYSTALLIZATION OF THIN SILICON FILMS FROM THE MELT”, Journal of Materials Research, vol. 3. pp. 1232-1237, 1988.
H. A. ATWATER and Thompson, C. V., “POINT-DEFECT ENHANCED GRAIN-GROWTH IN SILICON THIN-FILMS - THE ROLE OF ION-BOMBARDMENT AND DOPANTS”, Applied Physics Letters, vol. 53. pp. 2155-2157, 1988.
C. V. Thompson, “COARSENING OF PARTICLES ON A PLANAR SUBSTRATE - INTERFACE ENERGY ANISOTROPY AND APPLICATION TO GRAIN-GROWTH IN THIN-FILMS”, Acta Metallurgica, vol. 36. pp. 2929-2934, 1988.
P. G. BLAUNER, RO, J. S., BUTT, Y., Thompson, C. V., and MELNGAILIS, J., “FOCUSED ION-BEAM FABRICATION OF SUB-MICRON GOLD STRUCTURES”, Journal of the Electrochemical Society, vol. 135. pp. C538 - C538, 1988.
H. A. ATWATER, Thompson, C. V., and SMITH, H. I., “ION-BOMBARDMENT-ENHANCED GRAIN-GROWTH IN GERMANIUM, SILICON, AND GOLD THIN-FILMS”, Journal of Applied Physics, vol. 64. pp. 2337-2353, 1988.
H. J. KIM and Thompson, C. V., “KINETIC MODELING OF GRAIN-GROWTH IN POLYCRYSTALLINE SILICON FILMS DOPED WITH PHOSPHORUS OR BORON”, Journal of the Electrochemical Society, vol. 135. pp. 2312-2319, 1988.
H. J. FROST and Thompson, C. V., “COMPUTER-SIMULATION OF MICROSTRUCTURAL EVOLUTION IN THIN-FILMS”, Journal of Electronic Materials, vol. 17. pp. 447-458, 1988.
J. S. RO, DUBNER, A. D., Thompson, C. V., and MELNGAILIS, J., “ION INDUCED DEPOSITION OF GOLD-FILMS”, Journal of Vacuum Science & Technology B, vol. 6. pp. 1043-1043, 1988.
L. A. CLEVENGER, Thompson, C. V., CAMMARATA, R. C., and TU, K. N., “REACTION-KINETICS OF NICKEL SILICON MULTILAYER FILMS”, Applied Physics Letters, vol. 52. pp. 795-797, 1988.
H. A. ATWATER, Thompson, C. V., and SMITH, H. I., “INTERFACE-LIMITED GRAIN-BOUNDARY MOTION DURING ION-BOMBARDMENT”, Physical Review Letters, vol. 60. pp. 112-115, 1988.
H. J. FROST, Thompson, C. V., HOWE, C. L., and WHANG, J. H., “A 2-DIMENSIONAL COMPUTER-SIMULATION OF CAPILLARITY-DRIVEN GRAIN-GROWTH - PRELIMINARY-RESULTS”, Scripta Metallurgica, vol. 22. pp. 65-70, 1988.

1987

R. C. CAMMARATA, Thompson, C. V., and TU, K. N., “NISI2 PRECIPITATION IN NICKEL-IMPLANTED SILICON FILMS”, Applied Physics Letters, vol. 51. pp. 1106-1108, 1987.
J. E. PALMER, Thompson, C. V., and SMITH, H. I., “GRAIN-GROWTH AND GRAIN-SIZE DISTRIBUTIONS IN THIN GERMANIUM FILMS”, Journal of Applied Physics, vol. 62. pp. 2492-2497, 1987.
J. S. IM, TOMITA, H., and Thompson, C. V., “CELLULAR AND DENDRITIC MORPHOLOGIES ON STATIONARY AND MOVING LIQUID-SOLID INTERFACES IN ZONE-MELTING RECRYSTALLIZATION”, Applied Physics Letters, vol. 51. pp. 685-687, 1987.
C. V. Thompson, “GRAIN-GROWTH IN SILICON FILMS”, Journal of Metals, vol. 39. pp. A6 - A6, 1987.
H. A. ATWATER, SMITH, H. I., and Thompson, C. V., “LOW-TEMPERATURE ION-BEAM ENHANCED GRAIN-GROWTH IN THIN-FILMS”, Journal of Electronic Materials, vol. 16. pp. A7 - A7, 1987.
C. V. Thompson, FROST, H. J., and Spaepen, F., “THE RELATIVE RATES OF SECONDARY AND NORMAL GRAIN-GROWTH”, Acta Metallurgica, vol. 35. pp. 887-890, 1987.
S. M. GARRISON, CAMMARATA, R. C., Thompson, C. V., and SMITH, H. I., “SURFACE-ENERGY-DRIVEN GRAIN-GROWTH DURING RAPID THERMAL ANNEALING (LESS THAN 10 S) OF THIN SILICON FILMS”, Journal of Applied Physics, vol. 61. pp. 1652-1655, 1987.
H. J. FROST and Thompson, C. V., “THE EFFECT OF NUCLEATION CONDITIONS ON THE TOPOLOGY AND GEOMETRY OF TWO-DIMENSIONAL GRAIN STRUCTURES”, Acta Metallurgica, vol. 35. pp. 529-540, 1987.

1986

C. V. Thompson and CHO, J., “A NEW ELECTROMIGRATION TESTING TECHNIQUE FOR RAPID STATISTICAL EVALUATION OF INTERCONNECT TECHNOLOGY”, Ieee Electron Device Letters, vol. 7. pp. 667-668, 1986.
D. J. Srolovitz and Thompson, C. V., “BEADING INSTABILITIES IN THIN-FILM LINES WITH BAMBOO MICROSTRUCTURES”, Thin Solid Films, vol. 139. pp. 133-141, 1986.
H. J. KIM and Thompson, C. V., “COMPENSATION OF GRAIN-GROWTH ENHANCEMENT IN DOPED SILICON FILMS”, Applied Physics Letters, vol. 48. pp. 399-401, 1986.
C. C. WONG, SMITH, H. I., and Thompson, C. V., “SURFACE-ENERGY-DRIVEN SECONDARY GRAIN-GROWTH IN THIN AU FILMS”, Applied Physics Letters, vol. 48. pp. 335-337, 1986.

1985

C. V. Thompson, “SECONDARY GRAIN-GROWTH IN THIN-FILMS OF SEMICONDUCTORS - THEORETICAL ASPECTS”, Journal of Applied Physics, vol. 58. pp. 763-772, 1985.

1984

T. YONEHARA, SMITH, H. I., Thompson, C. V., and PALMER, J. E., “GRAPHOEPITAXY OF GE ON SIO2 BY SOLID-STATE SURFACE-ENERGY-DRIVEN GRAIN-GROWTH”, Applied Physics Letters, vol. 45. pp. 631-633, 1984.
C. V. Thompson and SMITH, H. I., “SURFACE-ENERGY-DRIVEN SECONDARY GRAIN-GROWTH IN ULTRATHIN (LESS-THAN-100 NM) FILMS OF SILICON”, Applied Physics Letters, vol. 44. pp. 603-605, 1984.

1983

C. V. Thompson, GREER, A. L., and Spaepen, F., “CRYSTAL NUCLEATION IN AMORPHOUS (AU100-YCUY)77SI9GE14 ALLOYS”, Acta Metallurgica, vol. 31. pp. 1883-1894, 1983.
H. I. SMITH, Thompson, C. V., and ATWATER, H. A., “GRAPHOEPITAXY AND ZONE-MELTING RECRYSTALLIZATION OF PATTERNED FILMS”, Journal of Crystal Growth, vol. 65. pp. 337-338, 1983.
C. V. Thompson and Spaepen, F., “HOMOGENEOUS CRYSTAL NUCLEATION IN BINARY METALLIC MELTS”, Acta Metallurgica, vol. 31. pp. 2021-2027, 1983.
H. A. ATWATER, Thompson, C. V., SMITH, H. I., and GEIS, M. W., “ORIENTATION FILTERING BY GROWTH-VELOCITY COMPETITION IN ZONE-MELTING RECRYSTALLIZATION OF SILICON ON SIO2”, Applied Physics Letters, vol. 43. pp. 1126-1128, 1983.
H. I. SMITH, GEIS, M. W., Thompson, C. V., and ATWATER, H. A., “SILICON-ON-INSULATOR BY GRAPHOEPITAXY AND ZONE-MELTING RECRYSTALLIZATION”, Journal of Crystal Growth, vol. 63. pp. 527-546, 1983.
M. W. GEIS, SMITH, H. I., SILVERSMITH, D. J., MOUNTAIN, R. W., and Thompson, C. V., “SOLIDIFICATION-FRONT MODULATION TO ENTRAIN SUBBOUNDARIES IN ZONE-MELTING RECRYSTALLIZATION OF SI ON SIO2”, Journal of the Electrochemical Society, vol. 130. pp. 1178-1183, 1983.
K. F. KELTON, GREER, A. L., and Thompson, C. V., “TRANSIENT NUCLEATION IN CONDENSED SYSTEMS”, Journal of Chemical Physics, vol. 79. pp. 6261-6276, 1983.

1982

K. F. KELTON, GREER, A. L., and Thompson, C. V., “MODELING OF TRANSIENT NUCLEATION IN CONDENSED PHASES”, Journal of Metals, vol. 34. pp. 12-12, 1982.

1979

C. V. Thompson and Spaepen, F., “APPROXIMATION OF THE FREE-ENERGY CHANGE ON CRYSTALLIZATION”, Acta Metallurgica, vol. 27. pp. 1855-1859, 1979.