Publications

Found 372 results
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1996
H. J. Frost and Thompson, C. V., Computer simulation of grain growth, Current Opinion in Solid State & Materials Science, vol. 1, no. 3, pp. 361 - 368, 1996.
R. CAREL, Thompson, C. V., and Frost, H. J., Computer simulation of strain energy effects vs surface and interface energy effects on grain growth in thin films, Acta Materialia, vol. 44, no. 6, pp. 2479 - 2494, 1996.
C. V. Thompson and Knowlton, B. D., Designing circuits and processes to optimize performance and reliability: Metallurgy meets TCAD, Microelectronics and Reliability, vol. 36, no. 11-12, pp. 1683 - 1690, 1996.
G. Bochi, Ballentine, C. A., Inglefield, H. E., Thompson, C. V., and OHandley, R. C., Evidence for strong surface magnetoelastic anisotropy in epitaxial Cu/Ni/Cu(001) sandwiches, Physical Review B, vol. 53, no. 4, pp. R1729 - R1732, 1996.
C. V. Thompson and CAREL, R., Grain growth and texture evolution in thin films, in Grain Growth in Polycrystalline Materials Ii, Pts 1 and 2, vol. 204-, H. Yoshinaga, Watanabe, T., and Takahashi, N. 1996, pp. 83 - 98.
J. Funatsu, Thompson, C. V., MELNGAILIS, J., and Walpole, J. N., Laser assisted focused-ion-beam-induced deposition of copper, Journal of Vacuum Science & Technology B, vol. 14, no. 1, pp. 179 - 180, 1996.
A. L. Greer, Samwer, K., and Thompson, C. V., Papers presented at the European Materials Research Society 1995 Spring Conference, Symposium E: Structure and Properties of Metallic Thin Films and Multilayers, Strasbourg, France, May 22-26, 1995 - Preface, Thin Solid Films, vol. 275, no. 1-2, pp. R9 - R9, 1996.
H. E. Inglefield, Bochi, G., Ballentine, C. A., OHandley, R. C., and Thompson, C. V., Perpendicular magnetic anisotropy in epitaxial Cu/Ni/Cu/Si(001), Thin Solid Films, vol. 275, no. 1-2, pp. 155 - 158, 1996.
G. Bochi, Ballentine, C. A., Inglefield, H. E., Thompson, C. V., and OHandley, R. C., Perpendicular magnetization and surface magnetoelastic anisotropy in epitaxial Cu/Ni/Cu(001), Journal of Applied Physics, vol. 79, no. 8, pp. 5845 - 5847, 1996.
C. V. Thompson and CAREL, R., Stress and grain growth in thin films, Journal of the Mechanics and Physics of Solids, vol. 44, no. 5, pp. 657 - 673, 1996.
S. C. Seel, CAREL, R., and Thompson, C. V., Texture maps for orientation evolution during grain growth in thin films, in Polycrystalline Thin Films: Structure, Texture, Properties, and Applications Ii, vol. 403, H. J. Frost, Parker, M. A., Ross, C. A., and Holm, E. A. 1996, pp. 63 - 70.
C. V. Thompson, What's up?, Mrs Bulletin, vol. 21, no. 1, pp. 4 - 4, 1996.
C. V. Thompson, What's up? Part deux, Mrs Bulletin, vol. 21, no. 12, pp. 3 - 4, 1996.
1995
B. D. Knowlton, Clement, J. J., Frank, R. I., and Thompson, C. V., Coupled stress evolution in polygranular clusters and bamboo segments in near-bamboo interconnects, in Materials Reliability in Microelectronics V, vol. 391, A. S. Oates, Filter, W. F., Rosenberg, R., Greer, A. L., and Gadepally, K. 1995, pp. 189 - 196.
B. D. Knowlton, Frank, R. I., and Thompson, C. V., The effect of Cu distribution on post-patterning grain growth and reliability of Al-1% Cu interconnects, in Materials Reliability in Microelectronics V, vol. 391, A. S. Oates, Filter, W. F., Rosenberg, R., Greer, A. L., and Gadepally, K. 1995, pp. 361 - 366.
J. J. Clement, Lloyd, J. R., and Thompson, C. V., Failure in tungsten-filled via structures, in Materials Reliability in Microelectronics V, vol. 391, A. S. Oates, Filter, W. F., Rosenberg, R., Greer, A. L., and Gadepally, K. 1995, pp. 423 - 428.
K. Tatah, Fukumoto, A., and Thompson, C. V., Laser ablation forward deposition of metal lines for electrical interconnect repair. 1995.
J. S. RO, Thompson, C. V., and MELNGAILIS, J., MICROSTRUCTURE OF GOLD GROWN BY ION-INDUCED DEPOSITION, Thin Solid Films, vol. 258, no. 1-2, pp. 333 - 335, 1995.
H. E. INGLEFIELD, Bochi, G., BALLENTINE, C. A., OHANDLEY, R. C., and Thompson, C. V., Misfit strain relief beyond the critical thickness using curvature measurements and in situ characterization of the magneto-optic Kerr effect, in Thin Films: Stresses and Mechanical Properties V, vol. 356, S. P. Baker, Ross, C. A., Townsend, P. H., Volkert, C. A., and Borgesen, P. 1995, pp. 265 - 270.
J. J. CLEMENT and Thompson, C. V., MODELING ELECTROMIGRATION-INDUCED STRESS EVOLUTION IN CONFINED METAL LINES, Journal of Applied Physics, vol. 78, no. 2, pp. 900 - 904, 1995.
C. V. Thompson, Joo, Y. C., and Knowlton, B. D., Modeling of the structure and reliability of near-bamboo interconnects, in Materials Reliability in Microelectronics V, vol. 391, A. S. Oates, Filter, W. F., Rosenberg, R., Greer, A. L., and Gadepally, K. 1995, pp. 163 - 176.
G. Bochi, BALLENTINE, C. A., INGLEFIELD, H. E., Thompson, C. V., OHANDLEY, R. C., HUG, H. J., STIEFEL, B., MOSER, A., and GUNTHERODT, H. J., PERPENDICULAR MAGNETIC-ANISOTROPY, DOMAINS, AND MISFIT STRAIN IN EPITAXIAL NI/CU1-XNIX/CU/SI (001) THIN-FILMS, Physical Review B, vol. 52, no. 10, pp. 7311 - 7321, 1995.
C. V. Thompson and CAREL, R., TEXTURE DEVELOPMENT IN POLYCRYSTALLINE THIN-FILMS, Materials Science and Engineering B-Solid State Materials for Advanced Technology, vol. 32, no. 3, pp. 211 - 219, 1995.

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