Publications

Found 372 results
Filters: Author is Carl V. Thompson  [Clear All Filters]
1999
C. S. Hau-Riege and Thompson, C. V., Microstructural evolution induced by scanned laser annealing in Al interconnects, Applied Physics Letters, vol. 75, no. 10, pp. 1464 - 1466, 1999.
Y. C. Joo, Baker, S. P., Arzt, E., and Thompson, C. V., Model studies of electromigration using indented single-crystal aluminum lines, in Stress Induced Phenomena in Metallization, vol. 491, O. Kraft, Arzt, E., Volkert, C. A., Ho, P. S., and Okabayashi, H. 1999, pp. 100 - 111.
C. V. Thompson, Hau-Riege, S. P., and Andleigh, V. K., Modeling and experimental characterization of electromigration in interconnect trees, in Stress Induced Phenomena in Metallization, vol. 491, O. Kraft, Arzt, E., Volkert, C. A., Ho, P. S., and Okabayashi, H. 1999, pp. 62 - 73.
S. P. Riege and Thompson, C. V., Modeling of texture evolution in copper interconnects annealed in trenches, Scripta Materialia, vol. 41, no. 4, pp. 403 - 408, 1999.
M. B. Wise, Thompson, C. V., Merriweather, R., Smith, R. R., and Guerin, M. R., On-site analysis of VOCs in water and soil by direct sampling ion trap mass spectrometry., Abstracts of Papers of the American Chemical Society, vol. 217, pp. U136 - U136, 1999.
S. P. Riege, Thompson, C. V., and Frost, H. J., Simulation of the influence of particles on grain structure evolution in two-dimensional systems and thin films, Acta Materialia, vol. 47, no. 6, pp. 1879 - 1887, 1999.
Y. J. Park, Andleigh, V. K., and Thompson, C. V., Simulations of stress evolution and the current density scaling of electromigration-induced failure times in pure and alloyed interconnects, Journal of Applied Physics, vol. 85, no. 7, pp. 3546 - 3555, 1999.
W. Fayad, Thompson, C. V., and Frost, H. J., Steady-state grain-size distributions resulting from grain growth in two dimensions, Scripta Materialia, vol. 40, no. 10, pp. 1199 - 1204, 1999.
1998
V. T. Srikar and Thompson, C. V., Diffusion and electromigration of Cu in single crystal Al interconnects, in Materials Reliability in Microelectronics Viii, vol. 516, J. C. Bravman, Marieb, T. N., Lloyd, J. R., and Korhonen, M. A. 1998, pp. 71 - 75.
V. T. Srikar and Thompson, C. V., The effect of Al3Ti capping layers on electromigration in single-crystal aluminum interconnects, Applied Physics Letters, vol. 72, no. 21, pp. 2677 - 2679, 1998.
S. P. Riege, Thompson, C. V., and Frost, H. J., The effect of particle-pinning on grain size distributions in 2D simulations of grain growth. 1998.
C. V. Thompson and Wise, M. B., Effects of Silcosteel (R) transfer line on the sampling of volatile organic compounds, Field Analytical Chemistry and Technology, vol. 2, no. 5, pp. 309 - 314, 1998.
A. Gouldstone, Shen, Y. L., Suresh, S., and Thompson, C. V., Evolution of stresses in passivated and unpassivated metal interconnects, Journal of Materials Research, vol. 13, no. 7, pp. 1956 - 1966, 1998.
D. Weiss, Mullner, P., Thompson, C. V., and Arzt, E., Grain growth in dispersion hardened copper films. 1998.
C. V. Thompson, Grain growth in polycrystalline thin films of semiconductors, Interface Science, vol. 6, no. 1-2, pp. 85 - 93, 1998.
W. Fayad, Andleigh, V., Thompson, C. V., and Frost, H. J., Grain structure statistics in As-patterned and annealed interconnects, in Materials Reliability in Microelectronics Viii, vol. 516, J. C. Bravman, Marieb, T. N., Lloyd, J. R., and Korhonen, M. A. 1998, pp. 159 - 164.
S. P. Riege, Thompson, C. V., and Clement, J. J., A hierarchical reliability analysis for circuit design evaluation, Ieee Transactions on Electron Devices, vol. 45, no. 10, pp. 2254 - 2257, 1998.
S. P. Riege, Andleigh, V., Thompson, C. V., and Frost, H. J., Modeling of grain structure evolution and its impact on the reliability of Al(Cu) thin film interconnects, in Semiconductor Process and Device Performance Modelling, vol. 490, S. T. Dunham and Nelson, J. S. 1998, pp. 219 - 224.
B. D. Knowlton and Thompson, C. V., Simulation of the temperature and current density scaling of the electromigration-limited reliability of near-bamboo interconnects, Journal of Materials Research, vol. 13, no. 5, pp. 1164 - 1170, 1998.
M. J. Kobrinsky and Thompson, C. V., The thickness dependence of the flow stress of capped and uncapped polycrystalline Ag thin films, Applied Physics Letters, vol. 73, no. 17, pp. 2429 - 2431, 1998.
H. J. Frost and Thompson, C. V., Thin film microstructures produced by nucleation and growth-to-impingement. 1998.

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