Publications
Found 8 results
Filters: Author is Ho, P. S. [Clear All Filters]
“Dominant inelastic mechanisms in FCC metallic thin films and lines”, in Stress-Induced Phenomena in Metallization, vol. 612, 2002, pp. 205 - 216.
, “Experimental characterization of the reliability of 3-terminal dual-damascene copper interconnect trees”, in Silicon Materials-Processing, Characterization and Reliability, vol. 716, 2002, pp. 431 - 436.
, “Length effects on the reliability of dual-damascene Cu interconnects”, in Silicon Materials-Processing, Characterization and Reliability, vol. 716, 2002, pp. 645 - 650.
, “Model studies of electromigration using indented single-crystal aluminum lines”, in Stress Induced Phenomena in Metallization, vol. 491, 1999, pp. 100 - 111.
, “Modeling and experimental characterization of electromigration in interconnect trees”, in Stress Induced Phenomena in Metallization, vol. 491, 1999, pp. 62 - 73.
, “MODELING OF MICROSTRUCTURES AND THEIR EFFECT ON INTERCONNECT RELIABILITY”, in Stress-Induced Phenomena in Metallization: Second International Workshop, 1994, pp. 254 - 269.
, “THE EFFECT OF THERMAL HISTORY ON INTERCONNECT RELIABILITY”, in Materials Reliability in Microelectronics Iii, vol. 309, 1993, pp. 383 - 394.
, “EVOLUTION OF ELECTROMIGRATION-INDUCED VOIDS IN SINGLE-CRYSTALLINE ALUMINUM LINES WITH DIFFERENT CRYSTALLOGRAPHIC ORIENTATIONS”, in Materials Reliability in Microelectronics Iii, vol. 309, 1993, pp. 351 - 356.
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