Publications

Found 8 results
Filters: Author is Ho, P. S.  [Clear All Filters]
2002
M. J. Kobrinsky and Thompson, C. V., “Dominant inelastic mechanisms in FCC metallic thin films and lines”, in Stress-Induced Phenomena in Metallization, vol. 612, S. P. Baker, Korhonen, M. A., Arzt, E., and Ho, P. S. 2002, pp. 205 - 216.
C. L. Gan, Thompson, C. V., Pey, K. L., Choi, W. K., Wei, F., Yu, B., and Hau-Riege, S. P., “Experimental characterization of the reliability of 3-terminal dual-damascene copper interconnect trees”, in Silicon Materials-Processing, Characterization and Reliability, vol. 716, J. L. Veteran, OMeara, D. L., Misra, V., and Ho, P. S. 2002, pp. 431 - 436.
F. Wei, Gan, C. L., Thompson, C. V., Clement, J. J., Hau-Riege, S. P., Pey, K. L., Choi, W. K., Tay, H. L., Yu, B., and Radhakrishnan, M. K., “Length effects on the reliability of dual-damascene Cu interconnects”, in Silicon Materials-Processing, Characterization and Reliability, vol. 716, J. L. Veteran, OMeara, D. L., Misra, V., and Ho, P. S. 2002, pp. 645 - 650.
1999
Y. C. Joo, Baker, S. P., Arzt, E., and Thompson, C. V., “Model studies of electromigration using indented single-crystal aluminum lines”, in Stress Induced Phenomena in Metallization, vol. 491, O. Kraft, Arzt, E., Volkert, C. A., Ho, P. S., and Okabayashi, H. 1999, pp. 100 - 111.
C. V. Thompson, Hau-Riege, S. P., and Andleigh, V. K., “Modeling and experimental characterization of electromigration in interconnect trees”, in Stress Induced Phenomena in Metallization, vol. 491, O. Kraft, Arzt, E., Volkert, C. A., Ho, P. S., and Okabayashi, H. 1999, pp. 62 - 73.
1994
H. J. FROST and Thompson, C. V., “MODELING OF MICROSTRUCTURES AND THEIR EFFECT ON INTERCONNECT RELIABILITY”, in Stress-Induced Phenomena in Metallization: Second International Workshop, P. S. Ho, Li, C. Y., and Totta, P. 1994, pp. 254 - 269.
1993
C. V. Thompson, “THE EFFECT OF THERMAL HISTORY ON INTERCONNECT RELIABILITY”, in Materials Reliability in Microelectronics Iii, vol. 309, K. P. Rodbell, Filter, W. F., Frost, H. J., and Ho, P. S. 1993, pp. 383 - 394.
Y. C. JOO and Thompson, C. V., “EVOLUTION OF ELECTROMIGRATION-INDUCED VOIDS IN SINGLE-CRYSTALLINE ALUMINUM LINES WITH DIFFERENT CRYSTALLOGRAPHIC ORIENTATIONS”, in Materials Reliability in Microelectronics Iii, vol. 309, K. P. Rodbell, Filter, W. F., Frost, H. J., and Ho, P. S. 1993, pp. 351 - 356.