Publications

Found 3 results
Filters: Author is Lloyd, J. R.  [Clear All Filters]
1995
J. J. Clement, Lloyd, J. R., and Thompson, C. V., Failure in tungsten-filled via structures, in Materials Reliability in Microelectronics V, vol. 391, A. S. Oates, Filter, W. F., Rosenberg, R., Greer, A. L., and Gadepally, K. 1995, pp. 423 - 428.