Publications

Found 2 results
Filters: Author is Tay, H. L.  [Clear All Filters]
2002
F. Wei, Gan, C. L., Thompson, C. V., Clement, J. J., Hau-Riege, S. P., Pey, K. L., Choi, W. K., Tay, H. L., Yu, B., and Radhakrishnan, M. K., “Length effects on the reliability of dual-damascene Cu interconnects”, in Silicon Materials-Processing, Characterization and Reliability, vol. 716, J. L. Veteran, OMeara, D. L., Misra, V., and Ho, P. S. 2002, pp. 645 - 650.
2001
C. L. Gan, Thompson, C. V., Pey, K. L., Choi, W. K., Tay, H. L., Yu, B., and Radhakrishnan, M. K., “Effect of current direction on the lifetime of different levels of Cu dual-damascene metallization”, Applied Physics Letters, vol. 79, no. 27, pp. 4592 - 4594, 2001.