Publications

Found 372 results
Filters: Author is Carl V. Thompson  [Clear All Filters]
2005
T. Trimble, Tang, L., Vasiljevic, N., Dimitrov, N., van Schilfgaarde, M., Friesen, C., Thompson, C. V., Seel, S. C., Floro, J. A., and Sieradzki, K., Anion adsorption induced reversal of coherency strain, Physical Review Letters, vol. 95, no. 16, 2005.
S. M. Alam, Gan, C. L., Wei, F. L., Thompson, C. V., and Troxel, D. E., Circuit-level reliability requirements for Cu metallization, Ieee Transactions on Device and Materials Reliability, vol. 5, no. 3, pp. 522 - 531, 2005.
C. Friesen and Thompson, C. V., Comment on "Compressive stress in polycrystalline Volmer-Weber films", Physical Review Letters, vol. 95, no. 22, 2005.
K. Y. Zang, Chua, S. J., Thompson, C. V., Wang, L. S., Tripathy, S., and Chow, S. Y., The effect of periodic silane burst on the properties of GaN on Si(III) substrates, in Gan, Ain, Inn and Their Alloys, vol. 831, C. Wetzel, Gil, B., Kuzuhara, M., and Manfra, M. 2005, pp. 221 - 226.
S. M. Alam, Wei, F. L., Gan, C. L., Thompson, C. V., and Troxel, D. E., Electromigration reliability comparison of Cu and Al interconnects. 2005.
H. Q. Le, Chua, S. J., Koh, Y. W., Loh, K. P., Chen, Z., Thompson, C. V., and Fitzgerald, E. A., Growth of single crystal ZnO nanorods on GaN using an aqueous solution method, Applied Physics Letters, vol. 87, no. 10, 2005.
Z. S. Choi, Chang, C. W., Lee, J. H., Gan, C. L., Thompson, C. V., Pey, K. L., and Choi, W. K., Multi-via electromigration test structures for identification and characterization of different failure mechanisms, in Materials, Technology and Reliability of Advanced Interconnects-2005, vol. 863, P. R. Besser, McKerrow, A. J., Iacopi, F., Wong, C. P., and Vlassak, J. J. 2005, pp. 271 - 276.
S. C. Seel and Thompson, C. V., Piezoresistive microcantilevers for in situ stress measurements during thin film deposition, Review of Scientific Instruments, vol. 76, no. 7, 2005.
A. L. Giermann and Thompson, C. V., Solid-state dewetting for ordered arrays of crystallographically oriented metal particles, Applied Physics Letters, vol. 86, no. 12, 2005.
R. Krishnan, Nguyen, H. Q., Thompson, C. V., Choi, W. K., and Foo, Y. L., Wafer-level ordered arrays of aligned carbon nanotubes with controlled size and spacing on silicon, Nanotechnology, vol. 16, no. 6, pp. 841 - 845, 2005.
2004
J. Jia, Li, M., and Thompson, C. V., Amorphization of silicon by femtosecond laser pulses, Applied Physics Letters, vol. 84, no. 16, pp. 3205 - 3207, 2004.
S. M. Alam, Lip, G. C., Thompson, C. V., and Troxel, D. E., Circuit level reliability analysis of Cu interconnects. 2004.
C. Friesen and Thompson, C. V., Correlation of stress and atomic-scale surface roughness evolution during intermittent homoepitaxial growth of (111)-oriented Ag and Cu, Physical Review Letters, vol. 93, no. 5, 2004.
C. V. Thompson, Gan, C. L., Alam, S. M., and Troxel, D. E., Experiments and models for circuit-level assessment of the reliability of Cu metallization. 2004.
Z. S. Choi, Gan, C. L., Wei, F., Thompson, C. V., Lee, J. H., Pey, K. L., and Choi, W. K., Fatal void size comparisons in via-below and via-above Cu dual-damascene interconnects, in Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2004, vol. 812, R. J. Carter, HauRiege, C. S., Lu, T. M., and Schulz, S. E. 2004, pp. 373 - 378.
T. J. Zhu, Lu, L., and Thompson, C. V., Growth and properties of (001)-oriented Pb(Zr0.52Ti0.48)O-3/LaNiO3 films on Si(001) substrates with TiN buffer layers, Journal of Crystal Growth, vol. 273, no. 1-2, pp. 172 - 178, 2004.
S. M. Alam, Wei, F., Gan, C. L., Thompson, C. V., and Troxel, D. E., Impact of non-blocking vias on electromigration and circuit-level reliability assessments of Cu interconnects. 2004.
C. W. Chang, Gan, C. L., Thompson, C. V., Pey, K. L., Choi, W. K., and Hwang, N., Mortality dependence of Cu dual damascene interconnects on adjacent segment, in Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2004, vol. 812, R. J. Carter, HauRiege, C. S., Lu, T. M., and Schulz, S. E. 2004, pp. 339 - 344.
C. Friesen, Seel, S. C., and Thompson, C. V., Reversible stress changes at all stages of Volmer-Weber film growth, Journal of Applied Physics, vol. 95, no. 3, pp. 1011 - 1020, 2004.
K. P. Liew, Bernstein, R. A., and Thompson, C. V., Stress development and relaxation during reactive film formation of Ni2Si, Journal of Materials Research, vol. 19, no. 2, pp. 676 - 680, 2004.
K. Y. Zang, Wang, L. S., Chua, S. J., and Thompson, C. V., Structural analysis of metalorganic chemical vapor deposited AlN nucleation layers on Si(111), Journal of Crystal Growth, vol. 268, no. 3-4, pp. 515 - 520, 2004.
A. L. Giermann, Thompson, C. V., and Smith, H. I., Templated formation of ordered metallic nano-particle arrays, in Nanoparticles and Nanowire Building Blocks-Synthesis, Processing, Characterization and Theory, vol. 818, O. J. Glembocki and Hunt, C. E. 2004, pp. 37 - 42.

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