Publications

Found 372 results
Filters: Author is Carl V. Thompson  [Clear All Filters]
2008
W. K. Choi, Liew, T. H., Chew, H. G., Zheng, F., Thompson, C. V., Wang, Y., Hong, M. H., Wang, X. D., Li, L., and Yun, J., A combined top-down and bottom-up approach for precise placement of metal nanoparticles on silicon (vol 4, pg 330, 2008), Small, vol. 4, no. 4, pp. 393 - 393, 2008.
Q. Guo, Li, M., Li, Y., Shi, L., Chong, T., Kalb, J. A., and Thompson, C. V., Crystallization-induced stress in thin phase change films of different thicknesses, Applied Physics Letters, vol. 93, no. 22, 2008.
F. L. Wei, Hau-Riege, C. S., Marathe, A. P., and Thompson, C. V., Effects of active atomic sinks and reservoirs on the reliability of Cu/low-k interconnects, Journal of Applied Physics, vol. 103, no. 8, 2008.
Z. - S. Choi, Moenig, R., and Thompson, C. V., Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects, Journal of Materials Research, vol. 23, no. 2, pp. 383 - 391, 2008.
R. Tadepalli, Turner, K. T., and Thompson, C. V., Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds, Acta Materialia, vol. 56, no. 3, pp. 438 - 447, 2008.
F. L. Wei, Gan, C. Lip, Tan, T. Lyn, Hau-Riege, C. S., Marathe, A. P., Vlassak, J. J., and Thompson, C. V., Electromigration-induced extrusion failures in Cu/low-k interconnects, Journal of Applied Physics, vol. 104, no. 2, 2008.
Y. Li, Guo, Q., Kalb, J. A., and Thompson, C. V., Matching Glass-Forming Ability with the Density of the Amorphous Phase, Science, vol. 322, no. 5909, pp. 1816 - 1819, 2008.
R. Tadepalli, Turner, K. T., and Thompson, C. V., Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test, Journal of the Mechanics and Physics of Solids, vol. 56, no. 3, pp. 707 - 718, 2008.
J. A. Kalb, Guo, Q., Zhang, X., Li, Y., Sow, C., and Thompson, C. V., Phase-Change Materials in Optically Triggered Microactuators, Journal of Microelectromechanical Systems, vol. 17, no. 5, pp. 1094 - 1103, 2008.
J. Oh and Thompson, C. V., Selective barrier perforation in porous alumina anodized on substrates, Advanced Materials, vol. 20, no. 7, p. 1368 - +, 2008.
W. K. Choi, Liew, T. H., Dawood, M. K., Smith, H. I., Thompson, C. V., and Hong, M. H., Synthesis of Silicon Nanowires and Nanofin Arrays Using Interference Lithography and Catalytic Etching, Nano Letters, vol. 8, no. 11, pp. 3799 - 3802, 2008.
G. D. Nessim, A. Hart, J., Kim, J. S., Acquaviva, D., Oh, J., Morgan, C. D., Seita, M., Leib, J. S., and Thompson, C. V., Tuning of Vertically-Aligned Carbon Nanotube Diameter and Areal Density through Catalyst Pre-Treatment, Nano Letters, vol. 8, no. 11, pp. 3587 - 3593, 2008.
C. V. Thompson, Using line-length effects to optimize circuit-level reliability. 2008.
2007
Z. - S. Choi, Moenig, R., and Thompson, C. V., Activation energy and prefactor for surface electromigration and void drift in Cu interconnects, Journal of Applied Physics, vol. 102, no. 8, 2007.
H. L. Leong, Gan, C. L., Thompson, C. V., Pey, K. L., and Li, H. Y., Application of contact theory to metal-metal bonding of silicon wafers, Journal of Applied Physics, vol. 102, no. 10, 2007.
H. Li, Zhang, Q., Peng, N., Liu, N., Lee, Y. Chau, Tan, O. Kiang, Marazari, N., and Thompson, C. V., Charge-trapping effects caused by ammonia in carbon nanotubes, Journal of Nanoscience and Nanotechnology, vol. 7, no. 1, pp. 335 - 338, 2007.
Z. - S. Choi, Monig, R., and Thompson, C. V., Dependence of the electromigration flux on the crystallographic orientations of different grains in polycrystalline copper interconnects, Applied Physics Letters, vol. 90, no. 24, 2007.
C. W. Chang, Thompson, C. V., Gan, C. L., Pey, K. L., Choi, W. K., and Lim, Y. K., Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects, Applied Physics Letters, vol. 90, no. 19, 2007.
R. Tadepalli and Thompson, C. V., Formation of Cu-Cu interfaces with ideal adhesive strengths via room temperature pressure bonding in ultrahigh vacuum, Applied Physics Letters, vol. 90, no. 15, 2007.
R. Krishnan and Thompson, C. V., Monodomain high-aspect-ratio 2D and 3D ordered porous alumina structures with independently controlled pore spacing and diameter, Advanced Materials, vol. 19, no. 7, p. 988 - +, 2007.
K. Y. Zang, Wang, Y. D., Wang, L. S., Tripathy, S., Chua, S. J., and Thompson, C. V., Nanoheteroepitaxy of GaN on a nanopore array of Si(111) surface, Thin Solid Films, vol. 515, no. 10, pp. 4505 - 4508, 2007.
S. M. Alam, Gan, C. Lip, Thompson, C. V., and Troxel, D. E., Reliability computer-aided design tool for full-chip electromigration analysis and comparison with different interconnect metallizations, Microelectronics Journal, vol. 38, no. 4-5, pp. 463 - 473, 2007.

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