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H. Mario, Gan, C. Lip, Lim, Y. Kheng, Tan, J. Boon, Wei, J., Chookajorn, T., and Thompson, C. V., Effects of Side Reservoirs on the Electromigration Lifetime of Copper Interconnects, 2011 18th Ieee International Symposium on the Physical and Failure Analysis of Integrated Circuits (ipfa), 2011.