Publications
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Filters: Author is Hwang, N. [Clear All Filters]
“Electromigration resistance in a short three-contact interconnect tree”, Journal of Applied Physics, vol. 99, no. 9, 2006.
, “Mortality dependence of Cu dual damascene interconnects on adjacent segment”, in Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2004, vol. 812, 2004, pp. 339 - 344.
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