Publications

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Filters: Keyword is wafer bonding and Author is Tana, Chuan Seng  [Clear All Filters]
2017
B. Wang, Lee, K. Hong, Wang, C., Wang, Y., Made, R. I., Sasangka, W. Aji, Nguyen, V. Cuong, Lee, K. Eng Kian, Tana, C. Seng, Yoon, S. Fatt, Fitzgerald, E. A., and Michel, J., The integration of InGaP LEDs with CMOS on 200 mm Silicon wafers, in Smart Photonic and Optoelectronic Integrated Circuits Xix, vol. 10107, L. A. Eldada, Lee, E. H., and He, S. Bellingham: Spie-Int Soc Optical Engineering, 2017, p. UNSP - 101070Y.