Found 6 results
Filters: Author is Joo, Y. C.  [Clear All Filters]
Z. - S. Choi, Monig, R., Thompson, C. V., and Burns, M., Kinetics of void drift in copper interconnects, in Materials, Technology and Reliability of Low-k Dielectrics and Copper Interconnects, vol. 914, T. Y. Tsui, Joo, Y. C., Michaelson, L., Lane, M., and Volinsky, A. A. 2006, pp. 363 - 368.
Y. W. Li and Cima, M. J., Bulge test on free standing gold thin films, in Thin Films-Stresses and Mechanical Properties X, vol. 795, S. G. Corcoran, Joo, Y. C., Moody, N. R., and Suo, Z. 2004, pp. 437 - 442.