Publications

Found 32 results
Filters: Author is Choi, W. K.  [Clear All Filters]
2004
Z. S. Choi, Gan, C. L., Wei, F., Thompson, C. V., Lee, J. H., Pey, K. L., and Choi, W. K., Fatal void size comparisons in via-below and via-above Cu dual-damascene interconnects, in Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2004, vol. 812, R. J. Carter, HauRiege, C. S., Lu, T. M., and Schulz, S. E. 2004, pp. 373 - 378.
C. W. Chang, Gan, C. L., Thompson, C. V., Pey, K. L., Choi, W. K., and Hwang, N., Mortality dependence of Cu dual damascene interconnects on adjacent segment, in Materials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2004, vol. 812, R. J. Carter, HauRiege, C. S., Lu, T. M., and Schulz, S. E. 2004, pp. 339 - 344.

Pages