STRATEGIES FOR BONDING W AND Al(2)O(3) AT LOW TEMPERATURES

TitleSTRATEGIES FOR BONDING W AND Al(2)O(3) AT LOW TEMPERATURES
Publication TypeBook Chapter
Year of Publication2005
AuthorsBoonyongmaneerat, Y, Schuh, CA, Eagar, TW
EditorZhu, D, Plucknett, K
Book TitleAdvances in Ceramic Coatings and Ceramic-Metal Systems
Volume26
Pagination399 - 406
Abstract

Several strategies for bonding W and Al(2)O(3) via co-sintering at temperatures below 1200 degrees C are investigated experimentally, with a particular emphasis on enhancing interfacial toughness and strength. These strategies include (i) a variation on the classical Mo-Mn process, and (ii) a conventional glass migration technique, as well as (iii) a series of new techniques based on the formation of a transient liquid phase. The interfacial strength of W/Al(2)O(3) co-sintered specimens and the sintered strength of the W layer are evaluated with the four-point bending delamination test. The microstructure and chemical composition of the systems are also examined, and related to the strength measurements.