Modeling of grain structure evolution and its impact on the reliability of Al(Cu) thin film interconnects

TitleModeling of grain structure evolution and its impact on the reliability of Al(Cu) thin film interconnects
Publication TypeBook Chapter
Year of Publication1998
AuthorsRiege, SP, Andleigh, V, Thompson, CV, Frost, HJ
EditorDunham, ST, Nelson, JS
Book TitleSemiconductor Process and Device Performance Modelling
Volume490
Pagination219 - 224
ISBN Number1-55899-395-9