Modeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures

TitleModeling of the effects of crystallographic orientation on electromigration-limited reliability of interconnects with bamboo grain structures
Publication TypeJournal Article
Year of Publication2001
AuthorsFayad, WR, Andleigh, VK, Thompson, CV
JournalJournal of Materials Research
Volume16
Issue2
Pagination413 - 416
Date Published2001/02//
ISBN Number0884-2914