Mixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test

TitleMixed-mode interface toughness of wafer-level Cu-Cu bonds using asymmetric chevron test
Publication TypeJournal Article
Year of Publication2008
AuthorsTadepalli, R, Turner, KT, Thompson, CV
JournalJournal of the Mechanics and Physics of Solids
Volume56
Issue3
Pagination707 - 718
Date Published2008/03//
ISBN Number0022-5096