Mechanical Property Characterization of Cu-Sn-In Intermetallic Thin Films using Microcantilevers

TitleMechanical Property Characterization of Cu-Sn-In Intermetallic Thin Films using Microcantilevers
Publication TypeJournal Article
Year of Publication2011
AuthorsSasangka, WA, Gan, CL, Thompson, CV
Journal2011 18th Ieee International Symposium on the Physical and Failure Analysis of Integrated Circuits (ipfa)
Date Published2011///
ISBN Number1946-1550