Length effects on the reliability of dual-damascene Cu interconnects

TitleLength effects on the reliability of dual-damascene Cu interconnects
Publication TypeBook Chapter
Year of Publication2002
AuthorsWei, F, Gan, CL, Thompson, CV, Clement, JJ, Hau-Riege, SP, Pey, KL, Choi, WK, Tay, HL, Yu, B, Radhakrishnan, MK
EditorVeteran, JL, OMeara, DL, Misra, V, Ho, PS
Book TitleSilicon Materials-Processing, Characterization and Reliability
Volume716
Pagination645 - 650
ISBN Number1-55899-652-4