Interconnect failure mechanism maps for different metallization materials and processes

TitleInterconnect failure mechanism maps for different metallization materials and processes
Publication TypeBook Chapter
Year of Publication1999
AuthorsAndleigh, VK, Park, YJ, Thompson, CV
EditorVolkert, CA, Verbuggen, AH, Brown, DD
Book TitleMaterials Reliability in Microelectronics Ix
Volume563
Pagination59 - 64
ISBN Number1-55899-470-X