Influence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films

TitleInfluence of Bonding Parameters on the Interaction Between Cu and Noneutectic Sn-In Solder Thin Films
Publication TypeJournal Article
Year of Publication2011
AuthorsSasangka, WA, Gan, CLip, Thompson, CV, Choi, WKyoung, Wei, J
JournalJournal of Electronic Materials
Volume40
Issue11
Pagination2329 - 2336
Date Published2011/11//
ISBN Number0361-5235