Formation of Cu-Cu interfaces with ideal adhesive strengths via room temperature pressure bonding in ultrahigh vacuum

TitleFormation of Cu-Cu interfaces with ideal adhesive strengths via room temperature pressure bonding in ultrahigh vacuum
Publication TypeJournal Article
Year of Publication2007
AuthorsTadepalli, R, Thompson, CV
JournalApplied Physics Letters
Volume90
Issue15
Date Published2007/04/09/
ISBN Number0003-6951