Experimental characterization and modeling of the mechanical properties of Cu-Cu thermocompression bonds for three-dimensional integrated circuits

TitleExperimental characterization and modeling of the mechanical properties of Cu-Cu thermocompression bonds for three-dimensional integrated circuits
Publication TypeJournal Article
Year of Publication2012
AuthorsMade, RI, Gan, CLip, Yan, L, Kor, KHwee Boon, Chia, HLing, Pey, KLeong, Thompson, CV
JournalActa Materialia
Volume60
Issue2
Pagination578 - 587
Date Published2012/01//
ISBN Number1359-6454