Experimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects

TitleExperimental characterization and modeling of the contact resistance of Cu-Cu bonded interconnects
Publication TypeJournal Article
Year of Publication2009
AuthorsLeong, HL, Gan, CL, Made, RI, Thompson, CV, Pey, KL, Li, HY
JournalJournal of Applied Physics
Volume105
Issue3
Date Published2009/02/01/
ISBN Number0021-8979