Electromigration-induced bond improvement for three-dimensional integrated circuits

TitleElectromigration-induced bond improvement for three-dimensional integrated circuits
Publication TypeJournal Article
Year of Publication2009
AuthorsLeong, HL, Gan, CL, Thompson, CV, Pey, KL, Li, HY
JournalApplied Physics Letters
Volume94
Issue8
Date Published2009/02/23/
ISBN Number0003-6951