Electromigration in Cu interconnects with very different grain structures

TitleElectromigration in Cu interconnects with very different grain structures
Publication TypeJournal Article
Year of Publication2001
AuthorsHau-Riege, CS, Thompson, CV
JournalApplied Physics Letters
Volume78
Issue22
Pagination3451 - 3453
Date Published2001/05/28/
ISBN Number0003-6951