Effects of patterning on the interface toughness of wafer-level Cu-Cu bonds

TitleEffects of patterning on the interface toughness of wafer-level Cu-Cu bonds
Publication TypeJournal Article
Year of Publication2008
AuthorsTadepalli, R, Turner, KT, Thompson, CV
JournalActa Materialia
Volume56
Issue3
Pagination438 - 447
Date Published2008/02//
ISBN Number1359-6454