Effects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects

TitleEffects of microstructure on the formation, shape, and motion of voids during electromigration in passivated copper interconnects
Publication TypeJournal Article
Year of Publication2008
AuthorsChoi, Z-S, Moenig, R, Thompson, CV
JournalJournal of Materials Research
Volume23
Issue2
Pagination383 - 391
Date Published2008/02//
ISBN Number0884-2914