The effects of the mechanical properties of the confinement material on electromigration in metallic interconnects

TitleThe effects of the mechanical properties of the confinement material on electromigration in metallic interconnects
Publication TypeJournal Article
Year of Publication2000
AuthorsHau-Riege, SP, Thompson, CV
JournalJournal of Materials Research
Volume15
Issue8
Pagination1797 - 1802
Date Published2000/08//
ISBN Number0884-2914