Dislocation pile-ups as sites for formation of electromigration-induced transgranular slit-like voids in Al interconnects

TitleDislocation pile-ups as sites for formation of electromigration-induced transgranular slit-like voids in Al interconnects
Publication TypeJournal Article
Year of Publication1999
AuthorsSrikar, VT, Thompson, CV
JournalScripta Materialia
Volume42
Issue1
Pagination97 - 102
Date Published1999/12/17/
ISBN Number1359-6462