Diffusion and electromigration of copper in SiO2-passivated single-crystal aluminum interconnects

TitleDiffusion and electromigration of copper in SiO2-passivated single-crystal aluminum interconnects
Publication TypeJournal Article
Year of Publication1999
AuthorsSrikar, VT, Thompson, CV
JournalApplied Physics Letters
Volume74
Issue1
Pagination37 - 39
Date Published1999/01/04/
ISBN Number0003-6951