Dependence of the electromigration flux on the crystallographic orientations of different grains in polycrystalline copper interconnects

TitleDependence of the electromigration flux on the crystallographic orientations of different grains in polycrystalline copper interconnects
Publication TypeJournal Article
Year of Publication2007
AuthorsChoi, Z-S, Monig, R, Thompson, CV
JournalApplied Physics Letters
Volume90
Issue24
Date Published2007/06/11/
ISBN Number0003-6951