Circuit-level reliability requirements for Cu metallization

TitleCircuit-level reliability requirements for Cu metallization
Publication TypeJournal Article
Year of Publication2005
AuthorsAlam, SM, Gan, CL, Wei, FL, Thompson, CV, Troxel, DE
JournalIeee Transactions on Device and Materials Reliability
Volume5
Issue3
Pagination522 - 531
Date Published2005/09//
ISBN Number1530-4388