Activation energy and prefactor for surface electromigration and void drift in Cu interconnects

TitleActivation energy and prefactor for surface electromigration and void drift in Cu interconnects
Publication TypeJournal Article
Year of Publication2007
AuthorsChoi, Z-S, Moenig, R, Thompson, CV
JournalJournal of Applied Physics
Volume102
Issue8
Date Published2007/10/15/
ISBN Number0021-8979