Multi-via electromigration test structures for identification and characterization of different failure mechanisms

TitleMulti-via electromigration test structures for identification and characterization of different failure mechanisms
Publication TypeBook Chapter
Year of Publication2005
AuthorsChoi, ZS, Chang, CW, Lee, JH, Gan, CL, Thompson, CV, Pey, KL, Choi, WK
EditorBesser, PR, McKerrow, AJ, Iacopi, F, Wong, CP, Vlassak, JJ
Book TitleMaterials, Technology and Reliability of Advanced Interconnects-2005
Volume863
Pagination271 - 276
ISBN Number1-55899-816-0