Fatal void size comparisons in via-below and via-above Cu dual-damascene interconnects

TitleFatal void size comparisons in via-below and via-above Cu dual-damascene interconnects
Publication TypeBook Chapter
Year of Publication2004
AuthorsChoi, ZS, Gan, CL, Wei, F, Thompson, CV, Lee, JH, Pey, KL, Choi, WK
EditorCarter, RJ, HauRiege, CS, Lu, TM, Schulz, SE
Book TitleMaterials, Technology and Reliability for Advanced Interconnects and Low-K Dielectrics-2004
Volume812
Pagination373 - 378
ISBN Number1-55899-762-8