Effects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects

TitleEffects of microvoids on the linewidth dependence of electromigration failure of dual-damascene copper interconnects
Publication TypeJournal Article
Year of Publication2007
AuthorsChang, CW, Thompson, CV, Gan, CL, Pey, KL, Choi, WK, Lim, YK
JournalApplied Physics Letters
Volume90
Issue19
Date Published2007/05/07/
ISBN Number0003-6951