Effect of Bonding and Aging Temperatures on Bond Strengths of Cu with 75Sn25In Solders

TitleEffect of Bonding and Aging Temperatures on Bond Strengths of Cu with 75Sn25In Solders
Publication TypeBook
Year of Publication2009
AuthorsSasangka, WA, Gan, CL, Thompson, CV, Choi, WK, Wei, J
ISBN Number978-1-4244-5099-2