Not stuck on silicon

April 19, 2017

A new technique developed by Jeehwan Kim and a team of researchers may vastly reduce the overall cost of wafer technology and enable devices made from more exotic, higher-performing semiconductor materials than conventional silicon.

The new method, reported today in Nature, uses graphene — single-atom-thin sheets of graphite — as a sort of “copy machine” to transfer intricate crystalline patterns from an underlying semiconductor wafer to a top layer of identical material.

A nickel film peel-off from a silicon wafer demonstrates the concept of using a 2-D-material-based transfer process for wafers.

Read the full article here!

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